| 6737265 |
Microelectronic unit forming methods and materials |
Masud Beroz, Joseph Fjelstad, Belgacem Haba, John W. Smith |
2004-05-18 |
| 6627478 |
Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction |
John W. Smith |
2003-09-30 |
| 6384475 |
Lead formation using grids |
Masud Beroz, Belgacem Haba |
2002-05-07 |
| 6361959 |
Microelectronic unit forming methods and materials |
Masud Beroz, Joseph Fjelstad, Belgacem Haba, John W. Smith |
2002-03-26 |
| 6358780 |
Semiconductor package assemblies with moisture vents and methods of making same |
John W. Smith |
2002-03-19 |
| 6208025 |
Microelectronic component with rigid interposer |
Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, John W. Smith |
2001-03-27 |
| 6080932 |
Semiconductor package assemblies with moisture vents |
John W. Smith |
2000-06-27 |
| 6063648 |
Lead formation usings grids |
Masud Beroz, Belgacem Haba |
2000-05-16 |
| 6002168 |
Microelectronic component with rigid interposer |
Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, John W. Smith |
1999-12-14 |