Issued Patents All Time
Showing 26–50 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709895 | Packaged microelectronic elements with enhanced thermal conduction | — | 2004-03-23 |
| 6706973 | Electrical connection with inwardly deformable contacts | Joseph Fjelstad | 2004-03-16 |
| 6700072 | Electrical connection with inwardly deformable contacts | Joseph Fjelstad | 2004-03-02 |
| 6687842 | Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element | John W. Smith | 2004-02-03 |
| 6653172 | Methods for providing void-free layers for semiconductor assemblies | Joseph Fjelstad | 2003-11-25 |
| 6635553 | Microelectronic assemblies with multiple leads | John W. Smith | 2003-10-21 |
| 6603209 | Compliant integrated circuit package | Konstantine Karavakis, Craig Mitchell, John W. Smith | 2003-08-05 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Anthony B. Faraci, Joseph Fjelstad, Belgacem Haba | 2003-04-01 |
| 6541874 | Encapsulation of microelectronic assemblies | Tan Nguyen, Craig Mitchell | 2003-04-01 |
| 6541852 | Framed sheets | Masud Beroz, John W. Smith | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, John W. Smith | 2003-02-25 |
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Joseph Fjelstad, John W. Smith | 2002-10-22 |
| 6465893 | Stacked chip assembly | Igor Y. Khandros | 2002-10-15 |
| 6465747 | Microelectronic assemblies having solder-wettable pads and conductive elements | Joseph Fjelstad | 2002-10-15 |
| 6460245 | Method of fabricating semiconductor chip assemblies | — | 2002-10-08 |
| 6458628 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Craig Mitchell | 2002-10-01 |
| 6458681 | Method for providing void free layer for semiconductor assemblies | Joseph Fjelstad | 2002-10-01 |
| 6433419 | Face-up semiconductor chip assemblies | Igor Y. Khandros | 2002-08-13 |
| 6392306 | Semiconductor chip assembly with anisotropic conductive adhesive connections | Igor Y. Khandros | 2002-05-21 |
| 6388340 | Compliant semiconductor chip package with fan-out leads and method of making same | — | 2002-05-14 |
| 6373141 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Zlata Kovac, John W. Smith | 2002-04-16 |
| 6372527 | Methods of making semiconductor chip assemblies | Igor Y. Khandros | 2002-04-16 |
| 6370032 | Compliant microelectronic mounting device | John W. Smith, Zlata Kovac, Konstantine Karavakis | 2002-04-09 |
| 6365975 | Chip with internal signal routing in external element | John W. Smith | 2002-04-02 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, John W. Smith | 2002-04-02 |