Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115896 | Semiconductor device and method of manufacturing the same | Hai-Dang Trinh, Yao-Wen Chang, Cheng-Yuan Tsai, Chin-Wei Liang | 2018-10-30 |
| 10109756 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yeur-Luen Tu | 2018-10-23 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10043705 | Memory device and method of forming thereof | Yao-Wen Chang, Sheng-Chau Chen, Alexander Kalnitsky | 2018-08-07 |
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2017-12-12 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9698190 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Shyh-Fann Ting, Ching-Chun Wang | 2017-07-04 |
| 9673239 | Image sensor device and method | Yeur-Luen Tu, Cheng-Yuan Tsai | 2017-06-06 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2016-11-08 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2016-09-06 |
| 9349769 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Shyh-Fann Ting, Ching-Chun Wang | 2016-05-24 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |
| 9153717 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2015-10-06 |