Issued Patents All Time
Showing 51–75 of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966405 | Method and apparatus for image sensor packaging | Dun-Nian Yaung | 2018-05-08 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung | 2018-04-10 |
| 9917132 | CMOS image sensor structure with IR/NIR integration | Tsung-Han Tsai, Kun-Huei Lin, Chun-Hao Chou, Ching-Chun Wang, Kuo-Cheng Lee +1 more | 2018-03-13 |
| 9905426 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-02-27 |
| 9887234 | CMOS image sensor and method for forming the same | Min-Feng Kao, Wei-Cheng Hsu, Tzu-Jui Wang, Hsiao-Hui Tseng, Jen-Cheng Liu +2 more | 2018-02-06 |
| 9871070 | Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors | Ching-Chun Wang, Chien-Hsien Tseng, Chen-Jong Wang, Feng-Chi Hung, Wen-I Hsu | 2018-01-16 |
| 9865645 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shu-Ting Tsai +1 more | 2018-01-09 |
| 9853082 | Color filter array and micro-lens structure for imaging system | Szu-Ying Chen, Dun-Nian Yaung, Chen-Jong Wang | 2017-12-26 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more | 2017-12-19 |
| 9812482 | Frontside illuminated (FSI) image sensor with a reflector | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Hsun-Ying Huang | 2017-11-07 |
| 9768224 | Image sensor including multiple lenses and method of manufacture thereof | Dun-Nian Yaung, Yean-Kuen Fang | 2017-09-19 |
| 9711562 | Apparatus and method for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Dun-Nian Yaung, Chun-Ming Su | 2017-07-18 |
| 9711560 | CMOS image sensor structure with IR/NIR integration | Tsung-Han Tsai, Kun-Huei Lin, Chun-Hao Chou, Ching-Chun Wang, Kuo-Cheng Lee +1 more | 2017-07-18 |
| 9704910 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2017-07-11 |
| 9673245 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Wen-I Hsu | 2017-06-06 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Min-Feng Kao | 2017-05-30 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9620548 | Image sensor with wide contact | Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yuichiro Yamashita | 2017-04-11 |
| 9559244 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Hsiao-Hui Tseng | 2017-01-31 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Shih Pei Chou | 2017-01-03 |
| 9473753 | Apparatus and method for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Ching-Chun Wang, Chun-Ming Su | 2016-10-18 |
| 9455158 | 3DIC interconnect devices and methods of forming same | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-27 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shu-Ting Tsai +1 more | 2016-05-31 |
| 9355964 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2016-05-31 |
| 9355888 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Wen-I Hsu | 2016-05-31 |