Issued Patents All Time
Showing 51–75 of 126 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11727188 | Semiconductor device including protruding conductor cell regions | Fong-Yuan Chang, Chin-Chou Liu, Sheng-Hsiung Chen | 2023-08-15 |
| 11704472 | Standard cells and variations thereof within a standard cell library | Sheng-Hsiung Chen, Jerry Chang Jui Kao, Fong-Yuan Chang, Shao-Huan Wang, XinYong WANG +2 more | 2023-07-18 |
| 11694926 | Barrier free interface between beol interconnects | Hsiu-Wen Hsueh, Chii-Ping Chen, Ya-Ching Tseng | 2023-07-04 |
| 11694973 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Yi-Kan Cheng +1 more | 2023-07-04 |
| 11675954 | Method of designing a device | Sheng-Hsiung Chen, Jyun-Hao Chang, Ting-Wei Chiang, Fong-Yuan Chang, I-Lun Tseng | 2023-06-13 |
| 11658157 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Chih-Lin Chen, Hui Yu Lee, Fong-Yuan Chang, Chin-Chou Liu | 2023-05-23 |
| 11637098 | Pin modification for standard cells | Fong-Yuan Chang, Lee-Chung Lu, Chun-Chen Chen, Chung-Te Lin, Ting-Wei Chiang +2 more | 2023-04-25 |
| 11626368 | Semiconductor device having fuse array and method of making the same | Meng-Sheng Chang, Shao-Yu Chou, An-Jiao Fu, Chih-Hao Chen | 2023-04-11 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Sen-Bor Jan +2 more | 2023-02-21 |
| 11574107 | Method for manufacturing a cell having pins and semiconductor device based on same | Pin-Dai Sue, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu +4 more | 2023-02-07 |
| 11568122 | Integrated circuit fin layout method | Fong-Yuan Chang, Clement Hsingjen Wann, Chih-Hsin Ko, Sheng-Hsiung Chen, Li-Chun Tien +1 more | 2023-01-31 |
| 11551968 | Inter-wire cavity for low capacitance | Hsiu-Wen Hsueh, Jiing-Feng Yang, Chii-Ping Chen, Chang-Wen Chen, Cai-Ling Wu | 2023-01-10 |
| 11552068 | Integrated circuit and method of generating integrated circuit layout | Fong-Yuan Chang, Kuo-Nan Yang, Chung-Hsing Wang, Lee-Chung Lu, Sheng-Fong Chen +3 more | 2023-01-10 |
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2022-12-20 |
| 11532580 | Interconnect structure, semiconductor structure including interconnect structure and method for forming the same | Jung-Chou Tsai, Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng | 2022-12-20 |
| 11527518 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu, Yu-Hao Chen +1 more | 2022-12-13 |
| 11495619 | Integrated circuit device with improved layout | Fong-Yuan Chang, Chun-Chen Chen, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao +2 more | 2022-11-08 |
| 11437708 | Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit | Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu | 2022-09-06 |
| 11437319 | Integrated circuit having a high cell density | Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-Yuan Chang, Lee-Chung Lu, Li-Chun Tien +6 more | 2022-09-06 |
| 11410929 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu +1 more | 2022-08-09 |
| 11410592 | Display method and display device using the same | Hsin-Tso Chiang, Tsun-Hou Chou | 2022-08-09 |
| 11410926 | E-fuse enhancement by underlayer layout design | An-Jiao Fu, Derek Hsen Dai Hsu, Hsiu-Wen Hsueh, Meng-Sheng Chang | 2022-08-09 |
| 11397842 | Method for generating layout diagram including protruding pin cell regions and semiconductor device based on same | Fong-Yuan Chang, Chin-Chou Liu, Sheng-Hsiung Chen | 2022-07-26 |
| 11387177 | Package structure and method for forming the same | Chin-Her Chien, Cheng-Hung Yeh, TAI-YU WANG, MING-KE TSAI, Yao-Hsien Tsai +6 more | 2022-07-12 |
| 11367695 | Interposer with capacitors | Fong-Yuan Chang, Cheng-Hung Yeh, Hsiang-Ho Chang, Chin-Her Chien, Sheng-Hsiung Chen +4 more | 2022-06-21 |