Issued Patents All Time
Showing 126–150 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8846528 | Method of modifying a low k dielectric layer having etched features and the resulting product | Joung-Wei Liou, Chung-Chi Ko, Chia-Cheng Chou | 2014-09-30 |
| 8629056 | Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Tien-I Bao, Chen-Hua Yu | 2014-01-14 |
| 8536064 | Double patterning strategy for contact hole and trench in photolithography | Chung-Chi Ko, Chih-Hao Chen | 2013-09-17 |
| 8481412 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Chia-Cheng Chou, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2013-07-09 |
| 8470708 | Double patterning strategy for contact hole and trench in photolithography | Po-Cheng Shih, Kuan-Chen Wang, Chung-Chi Ko, Tai-Yen Peng, Wen-Kuo Hsieh +1 more | 2013-06-25 |
| 8354346 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Chia-Cheng Chou, Ming-Chung Liang, Tzu-Li Lee | 2013-01-15 |
| 8258629 | Curing low-k dielectrics for improving mechanical strength | Joung-Wei Liou, Shwang-Ming Jeng | 2012-09-04 |
| 8105947 | Post etch dielectric film re-capping layer | Shwang-Ming Jeng, Kin-Weng Wang, Hsin-Yi Tsai, Chung-Chi Ko | 2012-01-31 |
| 7998873 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Chia-Cheng Chou, Ming-Chung Liang, Tzu-Li Lee | 2011-08-16 |
| RE42514 | Extreme low-K dielectric film scheme for advanced interconnects | Fang Wen Tsai, Kuan-Chen Wang, Chih-Lung Lin, Shwang-Ming Jeng | 2011-07-05 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |
| RE41935 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Wen-Chih Chiou, Shwang-Ming Jeng | 2010-11-16 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Yung-Cheng Lu, Pei-Ren Jeng, Chia-Cheng Chou, Chung-Chi Ko +2 more | 2010-05-25 |
| 7626245 | Extreme low-k dielectric film scheme for advanced interconnect | Fang Wen Tsai, Kuan-Chen Wang, Chih-Lung Lin, Shwang-Ming Jeng | 2009-12-01 |
| 7564136 | Integration scheme for Cu/low-k interconnects | Ming-Ling Yeh, Chen-Hua Yu, Tien-I Bao, Shwang-Ming Cheng | 2009-07-21 |
| 7485949 | Semiconductor device | Chung-Chi Ko, Chia-Cheng Chou, Zhen-Cheng Wu, Shwang-Ming Jeng | 2009-02-03 |
| 7466027 | Interconnect structures with surfaces roughness improving liner and methods for fabricating the same | Chung-Chi Ko, Chia-Cheng Chou | 2008-12-16 |
| 7456093 | Method for improving a semiconductor device delamination resistance | Pi-Tsung Chen, Hui-Lin Chang, Lih-Ping Li, Tien-I Bao, Yung-Cheng Lu +1 more | 2008-11-25 |
| 7429542 | UV treatment for low-k dielectric layer in damascene structure | Chung-Chi Ko, Tien-I Bao | 2008-09-30 |
| 7410895 | Methods for forming interconnect structures | Chung-Chi Ko, Yi-Chi Liao | 2008-08-12 |
| 7405481 | Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip | Yung-Cheng Lu, Shwang-Ming Cheng | 2008-07-29 |
| 7365026 | CxHy sacrificial layer for cu/low-k interconnects | Shwang-Ming Jeng, Ming-Ling Yeh, Tien-I Bao | 2008-04-29 |
| 7314828 | Repairing method for low-k dielectric materials | Chen-Hua Yu, Ching-Ya Wang, Chia-Cheng Chou, Tien-I Bao, Shwang-Ming Cheng | 2008-01-01 |
| 7256124 | Method of fabricating semiconductor device | Yi-Chi Liao, Hung Chun Tsai, Yung-Cheng Lu, Hung-Wen Su | 2007-08-14 |
| 7230596 | Active organic electroluminescence display panel module and driving module thereof | Hong-Ru Guo, Chen-Chung Yang | 2007-06-12 |