Issued Patents All Time
Showing 101–125 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134632 | Low-K dielectric layer and porogen | Joung-Wei Liou, Hui-Chun Yang, Yu-Yun Peng | 2018-11-20 |
| 9941214 | Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures | Yu-Yun Peng, Joung-Wei Liou, Kuang-Yuan Hsu | 2018-04-10 |
| 9870944 | Back-end-of-line (BEOL) interconnect structure | Joung-Wei Liou | 2018-01-16 |
| 9812390 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Joung-Wei Liou | 2017-11-07 |
| 9728402 | Flowable films and methods of forming flowable films | Kuan-Cheng Wang, Chun-Hao Hsu, Han-Ti Hsiaw | 2017-08-08 |
| 9647090 | Surface passivation for germanium-based semiconductor structure | Kuan-Cheng Wang, Chien-Feng Lin, Jeng-Yang Pan | 2017-05-09 |
| 9589856 | Automatically adjusting baking process for low-k dielectric material | Chia-Cheng Chou, Chung-Chi Ko, Shwang-Ming Jeng | 2017-03-07 |
| 9564383 | Low-K dielectric layer and porogen | Joung-Wei Liou, Hui-Chun Yang, Yu-Yun Peng | 2017-02-07 |
| 9379061 | High density dielectric etch-stop layer | Joung-Wei Liou, Han-Ti Hsiaw | 2016-06-28 |
| 9349689 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Joung-Wei Liou | 2016-05-24 |
| 9341945 | Photoresist and method of formation and use | Joung-Wei Liou, Cheng-Han Wu, Ya Hui Chang | 2016-05-17 |
| 9196551 | Automatically adjusting baking process for low-k dielectric material | Chia-Cheng Chou, Chung-Chi Ko, Shwang-Ming Jeng | 2015-11-24 |
| 9177918 | Apparatus and methods for low k dielectric layers | Yu-Yun Peng, Joung-Wei Liou, Hui-Chun Yang | 2015-11-03 |
| 9130017 | Methods for forming interconnect structures of integrated circuits | Po-Cheng Shih, Chung-Chi Ko | 2015-09-08 |
| 9093455 | Back-end-of-line (BEOL) interconnect structure | Joung-Wei Liou | 2015-07-28 |
| 9087877 | Low-k interconnect structures with reduced RC delay | Chung-Chi Ko, Ting-Yu Shen, Chia-Cheng Chou, Tien-I Bao, Shwang-Ming Jeng +1 more | 2015-07-21 |
| 9076845 | Method of forming a high density dielectric etch-stop layer | Joung-Wei Liou, Han-Ti Hsiaw | 2015-07-07 |
| 9059259 | Hard mask for back-end-of-line (BEOL) interconnect structure | Joung-Wei Liou, Han-Ti Hsiaw | 2015-06-16 |
| 9054110 | Low-K dielectric layer and porogen | Joung-Wei Liou, Hui-Chun Yang, Yu-Yun Peng | 2015-06-09 |
| 9004914 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Chia-Cheng Chou, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2015-04-14 |
| 8993435 | Low-k Cu barriers in damascene interconnect structures | Kuan-Chen Wang, Po-Cheng Shih, Chung-Chi Ko, Shwang-Ming Jeng | 2015-03-31 |
| 8940643 | Double patterning strategy for contact hole and trench in photolithography | Chung-Chi Ko, Chih-Hao Chen | 2015-01-27 |
| 8927420 | Mechanism of forming semiconductor device having support structure | Joung-Wei Liou | 2015-01-06 |
| 8889567 | Apparatus and methods for low K dielectric layers | Yu-Yun Peng, Joung-Wei Liou, Hui-Chun Yang | 2014-11-18 |
| 8853858 | Curing low-k dielectrics for improving mechanical strength | Joung-Wei Liou, Shwang-Ming Jeng | 2014-10-07 |