Issued Patents All Time
Showing 151–160 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7223692 | Multi-level semiconductor device with capping layer for improved adhesion | Tien-I Bao, Syun-Ming Jang | 2007-05-29 |
| 7135402 | Sealing pores of low-k dielectrics using CxHy | Shwang-Ming Cheng, Ming-Ling Yeh, Tien-I Bao | 2006-11-14 |
| 7094705 | Multi-step plasma treatment method to improve CU interconnect electrical performance | Hui-Lin Chang, I-I Chen, Yung-Chen Lu, Syun-Ming Jeng | 2006-08-22 |
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Wen-Chih Chiou, Shwang-Ming Jeng | 2005-01-25 |
| 6777336 | Method of forming a shallow trench isolation structure | Chih-Ta Wu | 2004-08-17 |
| 6656832 | Plasma treatment method for fabricating microelectronic fabrication having formed therein conductor layer with enhanced electrical properties | Shing-Chyang Pan, Shwangming Jen | 2003-12-02 |
| 6638853 | Method for avoiding photoresist resist residue on semioconductor feature sidewalls | Hung-Wen Sue, Chung-Shi Liu, Wen-Chin Chiou | 2003-10-28 |
| 6333277 | Method for reducing non-homogenous density during forming process of borophosphosilicate glass layer | Hsiao-Wen Lee, Hou-Hung Chou, Yi-Wen Chen | 2001-12-25 |
| 6153541 | Method for fabricating an oxynitride layer having anti-reflective properties and low leakage current | Liang-Gi Yao, Yue-Feng Cheu | 2000-11-28 |
| 6136688 | High stress oxide to eliminate BPSG/SiN cracking | Kuang-Chao Chen, Rong-Wu Chien, Lian-Fa Hung, Pang-Yen Tsai, Ching-Chang Chang | 2000-10-24 |