Issued Patents All Time
Showing 301–325 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037962 | Ball height control in bonding process | Tsung-Yuan Yu, Hsien-Wei Chen | 2018-07-31 |
| 10026704 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2018-07-17 |
| 10020271 | Calibration kits for RF passive devices | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2018-07-10 |
| 9997465 | Semiconductor package structure | Hsien-Wei Chen | 2018-06-12 |
| 9991247 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2018-06-05 |
| 9958717 | Method of adjusting display size | Dike Shan, Shih Ying Sun | 2018-05-01 |
| 9947626 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2018-04-17 |
| 9941228 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2018-04-10 |
| 9935084 | Devices and methods of packaging semiconductor devices | Hsien-Wei Chen | 2018-04-03 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2018-03-27 |
| 9916218 | Method and apparatus for intercepting implanted information in application | — | 2018-03-13 |
| 9881857 | Pad design for reliability enhancement in packages | Hsien-Wei Chen | 2018-01-30 |
| 9852998 | Ring structures in device die | Ying-Ju Chen, Hsien-Wei Chen | 2017-12-26 |
| 9837379 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2017-12-05 |
| 9831214 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen | 2017-11-28 |
| 9831205 | Semiconductor device and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2017-11-28 |
| 9825008 | Package-on-package device with supplemental underfill and method for manufacturing the same | Ying-Ju Chen, Hsien-Wei Chen | 2017-11-21 |
| 9820020 | Grooming method and device for packet optical transport network | Xuegang Ou, Xin Si, Hongbin Yu, Wei Luo, Xingming Li | 2017-11-14 |
| 9799614 | Calibration kits for RF passive devices | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2017-10-24 |
| 9793245 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2017-10-17 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2017-10-10 |
| 9768133 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2017-09-19 |
| 9754910 | Methods of packaging semiconductor devices and packaged semiconductor devices | Hsien-Wei Chen | 2017-09-05 |
| 9755667 | Methods and systems for parallelizing high throughput iterative decoders | Haoting Luo, Engling Yeo | 2017-09-05 |
| 9735129 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-08-15 |