Issued Patents All Time
Showing 326–350 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728517 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2017-08-08 |
| 9704739 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen | 2017-07-11 |
| 9704972 | Semiconductor structures and fabrication method thereof | Qiuhua Han | 2017-07-11 |
| 9679868 | Ball height control in bonding process | Tsung-Yuan Yu, Hsien-Wei Chen | 2017-06-13 |
| 9666502 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2017-05-30 |
| 9666553 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2017-05-30 |
| 9633961 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2017-04-25 |
| 9613857 | Electrostatic discharge protection structure and method | Hsien-Wei Chen | 2017-04-04 |
| 9589903 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2017-03-07 |
| 9589891 | Contact pad for semiconductor devices | Hsien-Wei Chen, Ying-Ju Chen | 2017-03-07 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9553001 | Method of forming a molding layer for semiconductor package | Hsien-Wei Chen | 2017-01-24 |
| 9502270 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2016-11-22 |
| 9502272 | Devices and methods of packaging semiconductor devices | Hsien-Wei Chen | 2016-11-22 |
| 9500005 | Gear structure for electronic lock | — | 2016-11-22 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2016-11-08 |
| 9472522 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2016-10-18 |
| 9461025 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2016-10-04 |
| 9425112 | Calibration kits for RF passive devices | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2016-08-23 |
| 9418952 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2016-08-16 |
| 9388605 | Electronic lock | — | 2016-07-12 |
| 9379075 | Semiconductor device with bump stop structure | Hsien-Wei Chen | 2016-06-28 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9375733 | Method and device for coating alignment film | — | 2016-06-28 |
| 9373674 | Sandwich damascene resistor | Chang Xiao, Roderick Miller | 2016-06-21 |