Issued Patents All Time
Showing 276–300 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10339146 | Device and method for providing media resource | Xuan Zheng, Bing Ji | 2019-07-02 |
| 10330972 | Transmissive liquid crystal panel and 3D printer | Chen-Cheng Wang | 2019-06-25 |
| 10317047 | Filtering unit and apparatus | — | 2019-06-11 |
| 10287314 | Methods of reducing level of one or more impurities in a sample during protein purification | Nanying Bian, Christopher Gillespie, Matthew T. Stone, Mikhail Kozlov, Martin Siwak | 2019-05-14 |
| 10269749 | Method of forming a semiconductor device with bump stop structure | Hsien-Wei Chen | 2019-04-23 |
| 10269764 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2019-04-23 |
| 10269767 | Multi-chip packages with multi-fan-out scheme and methods of manufacturing the same | Hsien-Wei Chen | 2019-04-23 |
| 10262957 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2019-04-16 |
| 10262952 | Ring structures in device die | Ying-Ju Chen, Hsien-Wei Chen | 2019-04-16 |
| 10204883 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2019-02-12 |
| 10204863 | Semiconductor package structure | Hsien-Wei Chen | 2019-02-12 |
| 10187654 | Method and device for forward multiple-hypothesis encoding/decoding of image block | Lu Yu, Yong Ling, Zhenjiang Shao, Xingguo Zhu | 2019-01-22 |
| 10181449 | Semiconductor structure | Hsien-Wei Chen, Ying-Ju Chen | 2019-01-15 |
| 10163800 | Package structure with dummy feature in passivation layer | Hsien-Wei Chen | 2018-12-25 |
| 10163866 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2018-12-25 |
| 10157854 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2018-12-18 |
| 10147691 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen | 2018-12-04 |
| 10134685 | Integrated circuit package and method of fabricating the same | Hsien-Wei Chen | 2018-11-20 |
| 10069103 | Organic light emitting diode package, method for manufacturing the same, and display device | Pengjie Xiao, Wei-Sheng Yu | 2018-09-04 |
| 10070497 | Smart lighting system and control method thereof | Liang WANG, Zhixian Zhou, Yang Hu, Tianhang Zheng, Jian Wang +4 more | 2018-09-04 |
| 10068887 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen | 2018-09-04 |
| 10051282 | Method for obtaining motion information with motion vector differences | Il-koo Kim | 2018-08-14 |
| 10037955 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2018-07-31 |
| 10037953 | Contact pad for semiconductor devices | Hsien-Wei Chen, Ying-Ju Chen | 2018-07-31 |
| 10037963 | Package structure and method of forming the same | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh | 2018-07-31 |