Issued Patents All Time
Showing 226–250 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10984041 | Natural language processing integrated with database and data storage management | Pavan Kumar Reddy Bedadala, Shilpa Nagendra, Rajesh Polimera, Aakash Chakravarthy Vijayakumar, Neha Mathur +8 more | 2021-04-20 |
| 10964659 | Semiconductor device | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2021-03-30 |
| 10943889 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2021-03-09 |
| 10930633 | Buffer design for package integration | Hsien-Wei Chen, Ming-Fa Chen, Chen-Hua Yu | 2021-02-23 |
| 10924758 | Method and apparatus for determining a motion vector | Jun Zhang, Yue Wu | 2021-02-16 |
| 10914043 | Construction method for a cantilever beam on a central pier | Gangliang Liu, Chengmin Wang, Zhongwen Wang, Yiming Xu, Rongfeng Chen +6 more | 2021-02-09 |
| 10904520 | Method and device for indicating pixel, and method and device for processing pixel indication | Sunil Lee | 2021-01-26 |
| 10892405 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Enis Tuncer, Usman Mahmood Chaudhry, Tony R. Larson +3 more | 2021-01-12 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2021-01-05 |
| 10886238 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2021-01-05 |
| 10880548 | Methods and apparatuses for encoding and decoding video according to coding order | Yin-ji Piao, Chan-yul Kim | 2020-12-29 |
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2020-12-22 |
| 10867967 | Chip package with redistribution layers | Hsien-Wei Chen | 2020-12-15 |
| 10817372 | Systems and methods for ultra fast ECC with parity | Zining Wu | 2020-10-27 |
| 10811390 | Die stack structure and method of fabricating the same and package | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-20 |
| 10798375 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2020-10-06 |
| 10797001 | Three-dimensional integrated circuit structures | Hsien-Wei Chen, Ying-Ju Chen | 2020-10-06 |
| 10756007 | Pad design for reliability enhancement in packages | Hsien-Wei Chen | 2020-08-25 |
| 10750201 | Encoding method, decoding method and device for video global disparity vector | Jun Zhang | 2020-08-18 |
| 10741512 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2020-08-11 |
| 10740008 | Memory and data reading method including performing N read operations on an address and determining whether the data is consistent | Mingguang Wang, Yu Liu | 2020-08-11 |
| 10719394 | Systems and methods for fast access of non-volatile storage devices | Zining Wu | 2020-07-21 |
| 10715182 | Systems and methods for decoding error correcting codes with self-generated LLR | Chung-Li Wang, Zining Wu | 2020-07-14 |
| 10700040 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2020-06-30 |