Issued Patents All Time
Showing 201–225 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183475 | Semiconductor structure | Hsien-Wei Chen, Ying-Ju Chen | 2021-11-23 |
| 11177200 | Pad design for reliability enhancement in packages | Hsien-Wei Chen | 2021-11-16 |
| 11177201 | Semiconductor packages including routing dies and methods of forming same | Ying-Ju Chen, Hsien-Wei Chen | 2021-11-16 |
| 11164857 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2021-11-02 |
| 11165536 | Early termination with distributed CRC polar codes | Keeth Saliya Jayasinghe Laddu, Dongyang Du, Yu-Hsiang Chen | 2021-11-02 |
| 11159182 | Systems and methods for decoding error correcting codes with historical decoding information | Bo Fu, Zining Wu | 2021-10-26 |
| 11146290 | Bit-flipping method for decoding LDPC code and system using the same | Chenrong Xiong, Zining Wu | 2021-10-12 |
| 11145622 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2021-10-12 |
| 11119047 | SERS substrate of metal-modified semiconductor-based bionic compound eye bowl structure and construction method | Gang Shi, Ying Li, Xuan Jin, Likui Wang, Dawei Wang +3 more | 2021-09-14 |
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen | 2021-09-14 |
| 11115051 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2021-09-07 |
| 11107680 | Mask assembly and method for fabricating a chip package | Hsien-Wei Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2021-08-31 |
| 11088041 | Semiconductor packages with shortened talking path | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2021-08-10 |
| 11069662 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2021-07-20 |
| 11056464 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2021-07-06 |
| 11056433 | Redistribution layer structures for integrated circuit package | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2021-07-06 |
| 11051265 | Method and device for synchronization between base stations | — | 2021-06-29 |
| 11042677 | Systems and methods for time series simulation | Rao Fu, Shutian Zeng, Yiping Zhuang, Agus Sudjianto | 2021-06-22 |
| 11039135 | Encoding method based on encoding order change and device therefor, and decoding method based on encoding order change and device therefor | Yin-ji Piao | 2021-06-15 |
| 11038975 | Information pushing method and device | — | 2021-06-15 |
| 11018892 | Broadband remote access server (BRAS) system-based packet encapsulation | Zhouyi Yu, Hongtao Guo, Qian Cao | 2021-05-25 |
| 11018091 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2021-05-25 |
| 11018070 | Semiconductor die, manufacturing method thereof, and semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2021-05-25 |
| 11004838 | Packaged die and RDL with bonding structures therebetween | Hsien-Wei Chen | 2021-05-11 |
| 10998293 | Method of fabricating semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Ching-Jung Yang | 2021-05-04 |