Issued Patents All Time
Showing 251–275 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665572 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658339 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2020-05-12 |
| 10629560 | Semiconductor structure | Hsien-Wei Chen, Ying-Ju Chen | 2020-04-21 |
| 10629555 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2020-04-21 |
| 10623773 | Method and device for encoding and decoding intra-frame skip mode information | Jin Young Lee | 2020-04-14 |
| 10585094 | Devices and methods for nanoparticle enhanced impedance-based molecular sensing | Scott MacKay, Peter Hermansen, David Wishart | 2020-03-10 |
| 10574274 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2020-02-25 |
| 10572499 | Displaying a hierarchical data structure within a graphical user interface | Li Zhang, Jie Jiang, Wen Juan Nie, Zai Cen, Ke Yin +1 more | 2020-02-25 |
| 10564858 | Data storage device with selective connection to non-volatile memories | Wei Jiang, Chiahung Chien, Lin Chen, Zining Wu | 2020-02-18 |
| 10547868 | Method and device for encoding and decoding information indicating intra skip mode prediction method | Jin Young Lee | 2020-01-28 |
| 10522490 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2019-12-31 |
| 10521546 | Optical proximity correction method and system | Jinyin Wan, Jinheng Wang, Lei Zhang | 2019-12-31 |
| 10515922 | Multi-chip integrated fan-out package | Hsien-Wei Chen | 2019-12-24 |
| 10511860 | Signal transforming method and device | Xing Zhu, Yu Lu | 2019-12-17 |
| 10510668 | Method of fabricating semiconductor device | Hsien-Wei Chen | 2019-12-17 |
| 10510678 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2019-12-17 |
| 10511326 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2019-12-17 |
| 10504852 | Three-dimensional integrated circuit structures | Hsien-Wei Chen, Ying-Ju Chen | 2019-12-10 |
| 10491244 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2019-11-26 |
| 10475760 | Semiconductor device | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2019-11-12 |
| 10461060 | Structure and formation method of chip package with redistribution layers | Hsien-Wei Chen | 2019-10-29 |
| 10412855 | Air deflection system | Wei Li, Zhao Zhang, Nan Wang | 2019-09-10 |
| 10366953 | Redistribution layer structures for integrated circuit package | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen | 2019-07-30 |