Issued Patents All Time
Showing 176–200 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11397641 | Systems and methods for ultra fast ECC with parity | Zining Wu | 2022-07-26 |
| 11393797 | Chip package with redistribution layers | Hsien-Wei Chen | 2022-07-19 |
| 11387204 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen | 2022-07-12 |
| 11386322 | System, method, and computer-program product for routing in an electronic design using deep learning | Weibin Ding, Chao Luo, Xin Zhang | 2022-07-12 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2022-06-28 |
| 11362065 | Package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |
| 11356664 | Methods and apparatuses for encoding and decoding video according to coding order | Yin-ji Piao, Chan-yul Kim | 2022-06-07 |
| 11348000 | System, method, and computer-program product for routing in an electronic design using deep learning | Weibin Ding | 2022-05-31 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sen-Bor Jan, Sung-Feng Yeh | 2022-05-24 |
| 11335610 | Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang | 2022-05-17 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-04-19 |
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2022-04-19 |
| 11270989 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2022-03-08 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen | 2022-03-01 |
| 11257791 | Stacked die structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2022-02-22 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Ming-Fa Chen | 2022-02-15 |
| 11249674 | Electrical mirroring by NAND flash controller | Gang Zhao, Lin Chen, Wei Jiang | 2022-02-15 |
| 11237902 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2022-02-01 |
| 11217552 | Multi-chip integrated fan-out package | Hsien-Wei Chen | 2022-01-04 |
| 11204829 | Systems and methods for an ECC architecture with prioritized task queues | Bo Fu, Xiaoming Zhu, Zining Wu | 2021-12-21 |
| 11200190 | Command based on-die termination for high-speed NAND interface | Gang Zhao, Wei Jiang, Lin Chen | 2021-12-14 |
| 11196445 | Distributed CRC polar codes | Keeth Saliya Jayasinghe, Yu-Hsiang Chen, Dongyang Du | 2021-12-07 |
| 11195810 | Bonding structure and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2021-12-07 |
| D936404 | Chair | Jianglin Wang, Zhengxing Wang, Wenbin Dai | 2021-11-23 |