JC

Jie Chen

TSMC: 198 patents #78 of 12,232Top 1%
IC Innogrit Technologies Co.: 43 patents #1 of 53Top 2%
Samsung: 24 patents #5,361 of 75,807Top 8%
Huawei: 13 patents #1,042 of 15,535Top 7%
TI Texas Instruments: 12 patents #1,155 of 12,488Top 10%
Wells Fargo Bank, N.A.: 9 patents #191 of 2,138Top 9%
ST Silego Technology: 5 patents #6 of 36Top 20%
T( The Nielsen Company (Us): 4 patents #285 of 768Top 40%
BT Beijing Institute Of Technology: 4 patents #16 of 409Top 4%
TE Tencent: 4 patents #1,478 of 8,131Top 20%
NL Nyquist Semiconductor Limited: 4 patents #2 of 7Top 30%
GA Governors Of The University Of Alberta: 3 patents #71 of 713Top 10%
HL Hkc Corporation Limited: 3 patents #94 of 318Top 30%
EM Emd Millipore: 3 patents #123 of 345Top 40%
IBM: 3 patents #26,272 of 70,183Top 40%
PS Polymer Technology Systems: 3 patents #10 of 58Top 20%
AC Ant Precision Industry Co.: 3 patents #2 of 3Top 70%
LE Leanics: 3 patents #3 of 8Top 40%
Philips: 2 patents #2,426 of 7,731Top 35%
CS Cadence Design Systems: 2 patents #781 of 2,263Top 35%
GP Globalfoundries Singapore Pte.: 2 patents #291 of 828Top 40%
HC Hesai Technology Co.: 2 patents #15 of 46Top 35%
Nokia Technologies Oy: 2 patents #1,075 of 3,242Top 35%
JU Jiangnan University: 1 patents #442 of 1,321Top 35%
MIT: 1 patents #4,386 of 9,367Top 50%
NB Nxp B.V.: 1 patents #1,722 of 3,591Top 50%
OC Opple Lighting Co.: 1 patents #107 of 187Top 60%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
SU Shanghai Jiao Tong University: 1 patents #250 of 905Top 30%
SC Shanghai Tianma Micro-Electronics Co.: 1 patents #254 of 417Top 65%
SP State Grid Shanghai Municipal Electric Power: 1 patents #1 of 61Top 2%
TC Tcl China Star Optoelectronics Technology Co.: 1 patents #253 of 470Top 55%
TU Tongji University: 1 patents #158 of 526Top 35%
WU Wuhan University: 1 patents #86 of 376Top 25%
AB AbbVie: 1 patents #860 of 1,308Top 70%
ZU Zhejiang University: 1 patents #773 of 2,379Top 35%
Disney: 1 patents #3,944 of 6,686Top 60%
IN Intel: 1 patents #18,218 of 30,777Top 60%
XC Xi'An Zhongxing New Software Co.: 1 patents #205 of 714Top 30%
AM Amazon: 1 patents #10,608 of 19,158Top 60%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
Alcatel Lucent: 1 patents #1,993 of 4,169Top 50%
AT Applied Komatsu Technology: 1 patents #36 of 62Top 60%
BC Beijing Boe Technology Development Co.: 1 patents #690 of 1,775Top 40%
BC Beijing Jingdong Century Trading Co.: 1 patents #54 of 287Top 20%
BC Beijing Jingdong Shangke Information Technology Co.: 1 patents #67 of 329Top 25%
BL Beijing Qihoo Techology Company Limited: 1 patents #96 of 230Top 45%
CC Cccc Highway Consultants Co.: 1 patents #10 of 45Top 25%
CT Changzhou Institute Of Technology: 1 patents #10 of 28Top 40%
CS Commvault Systems: 1 patents #228 of 280Top 85%
CC Csmc Technologies Fab2 Co.: 1 patents #92 of 208Top 45%
DC Datang Mobile Communications Equipment Co.: 1 patents #148 of 278Top 55%
FS Freeescale Semiconductor: 1 patents #2,021 of 3,767Top 55%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
HC Hefei Boe Display Technology Co.: 1 patents #109 of 218Top 50%
HT Hefei University Of Technology: 1 patents #137 of 484Top 30%
HC Henglin Home Furnishings Co.: 1 patents #6 of 13Top 50%
HL Hughes Electronics Limited: 1 patents #605 of 1,474Top 45%
HM Hyzon Motors: 1 patents #5 of 7Top 75%
IV Imec Vzw: 1 patents #463 of 1,046Top 45%
📍 Shanghai, CA: #4 of 801 inventorsTop 1%
Overall (All Time): #655 of 4,157,543Top 1%
395
Patents All Time

Issued Patents All Time

Showing 126–150 of 395 patents

Patent #TitleCo-InventorsDate
11715755 Structure and method for forming integrated high density MIM capacitor Hsien-Wei Chen, Ying-Ju Chen, Ming-Fa Chen 2023-08-01
11709789 Command based on-die termination for high-speed NAND interface Gang Zhao, Wei Jiang, Lin Chen 2023-07-25
11695918 Encoding method and device therefor, and decoding method and device therefor Yin-ji Piao, Chan-yul Kim 2023-07-04
11695502 Packet processing method and apparatus, and chip Qing Chen, Jiyuan Shi 2023-07-04
11695434 Systems and methods for decoding error correcting codes with historical decoding information Bo Fu, Zining Wu 2023-07-04
11693016 Systems and methods for electrochemical point-of-care detection of hemoglobin Donnie Smith, Brittney Werner, Gary L. Hughes 2023-07-04
11682594 Semiconductor structure including interconnection to probe pad with probe mark Hsien-Wei Chen, Ching-Jung Yang 2023-06-20
11676939 Discrete polymer in fan-out packages Hsien-Wei Chen 2023-06-13
11670621 Die stack structure Hsien-Wei Chen, Ming-Fa Chen 2023-06-06
11664336 Bonding structure and method of forming same Hsien-Wei Chen, Ming-Fa Chen 2023-05-30
11640958 Packaged die and RDL with bonding structures therebetween Hsien-Wei Chen 2023-05-02
11634457 Methods of reducing level of one or more impurities in a sample during protein purification Nanying Bian, Christopher Gillespie, Matthew T. Stone, Mikhail Kozlov, Martin Siwak 2023-04-25
11622110 Methods and apparatuses for encoding and decoding video according to coding order Yin-ji Piao, Chan-yul Kim 2023-04-04
11621728 Concatenated error correcting codes Chenrong Xiong 2023-04-04
11621232 Semiconductor package with electromagnetic interference shielding Yiqi Tang, Rajen Manicon Murugan, Liang Wan 2023-04-04
11621214 Semiconductor package and method for manufacturing the same Hsien-Wei Chen, Ming-Fa Chen 2023-04-04
11616971 Encoding and decoding method and device for determining a decoding order between a left and a right lower blocks Yin-ji Piao, Elena Alshina 2023-03-28
11611353 Quantizer for sigma-delta modulator, sigma-delta modulator, and noise-shaped method Kunyu Wang, Li ZHOU, Minghui Chen, Ming-Syuan Chen, Wenjing Xu +1 more 2023-03-21
11610980 Method for processing a FinFET device Boon Teik Chan, Changyong Xiao 2023-03-21
11610169 Dynamic prediction modeling Weicheng Liu 2023-03-21
11609391 Semiconductor package and manufacturing method thereof Hsien-Wei Chen, Ming-Fa Chen 2023-03-21
11606223 Broadband remote access server (BRAS) system-based packet encapsulation Zhouyi Yu, Hongtao Guo, Qian Cao 2023-03-14
11605126 Detecting fraud in credit applications Carmel Nadav, Manish Pandey 2023-03-14
11574847 Seal ring between interconnected chips mounted on an integrated circuit Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu 2023-02-07
11574096 Systems and methods for time series simulation Rao Fu, Shutian Zeng, Yiping Zhuang, Agus Sudjianto 2023-02-07