Issued Patents All Time
Showing 101–125 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Ching-Jung Yang | 2023-12-05 |
| 11836092 | Non-volatile storage controller with partial logical-to-physical (L2P) address translation table | Bo Fu, Chi-Chun Lai, Dishi Lai, Jian WU, Cheng-Yun Hsu +1 more | 2023-12-05 |
| 11829841 | Mechanical energy-based self-powering counting system | Fang Deng, Yeyun Cai, Ning Ding, Chengwei Mi, Jiachen Zhao +5 more | 2023-11-28 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2023-11-14 |
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2023-11-14 |
| 11798931 | Semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2023-10-24 |
| 11798472 | Pixel circuit, display panel, and display device | Xueqiang Ning, Jianlei Li, Peidi HUANG, Kelin Li, Tao Gu +1 more | 2023-10-24 |
| 11791333 | Three-dimensional integrated circuit structures and method of forming the same | Hsien-Wei Chen | 2023-10-17 |
| 11782209 | Optical cross apparatus | Qian Wang, Yongping Liao | 2023-10-10 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-09-26 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Ming-Fa Chen | 2023-09-26 |
| 11763049 | Systems and methods for time series simulation | Rao Fu, Shutian Zeng, Yiping Zhuang, Agus Sudjianto | 2023-09-19 |
| 11764165 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2023-09-19 |
| 11757108 | Production method used for single cell components sealing | — | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen | 2023-09-12 |
| 11749651 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2023-09-05 |
| 11735555 | Manufacturing method of semiconductor structure | Hsien-Wei Chen, Ying-Ju Chen | 2023-08-22 |
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2023-08-22 |
| 11735506 | Packages with multiple exposed pads | Hung-Yu Chou, Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl +1 more | 2023-08-22 |
| 11735286 | Selecting read reference voltage using historical decoding information | Bo Fu, Zining Wu | 2023-08-22 |
| 11734109 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2023-08-22 |
| 11728334 | Three-dimensional integrated circuit structures and method of forming the same | Hsien-Wei Chen | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2023-08-15 |
| 11726872 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2023-08-15 |
| 11726695 | Electrical mirroring by NAND flash controller | Gang Zhao, Lin Chen, Wei Jiang | 2023-08-15 |