Issued Patents All Time
Showing 51–75 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119651 | Resilience enhancement-oriented energy storage control method and system for distributed generator (DG) in distribution network | Saiyi Wang, Xin Huang, Weiguo He, Chaoran Fu, Haodong Shen +5 more | 2024-10-15 |
| 12119338 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2024-10-15 |
| 12119318 | Bonding structure and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2024-10-15 |
| 12112645 | Unmanned aerial vehicle positioning method based on millimeter-wave radar | Bin He, Gang Li, Runjie Shen, Yanmin ZHOU, Shuping Song | 2024-10-08 |
| 12106280 | Accounting event process optimization for multi-tenant systems | Catalin Mihai Constantin, Shobhit Sinha, Subhas Chandra Dey, Manish Lonial, Michael J. Kearney +1 more | 2024-10-01 |
| 12105587 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2024-10-01 |
| 12097661 | Construction method of 3D printing and weaving integrated building | Xiaoyan Sun, Hailong Wang, Qun Wang, Chao Gao, Zhicheng Zhang | 2024-09-24 |
| 12088349 | Signal pre-compensation method and apparatus | Solovev Dmitry, Jiashen TIAN | 2024-09-10 |
| 12087755 | Method of fabricating package structure | Hsien-Wei Chen, Ming-Fa Chen | 2024-09-10 |
| 12087668 | Semiconductor package and method for manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2024-09-10 |
| 12081270 | Device and method for decoding and equalizing | Starovoit Ivan, Plotnikov Pavel, Hongchen Yu | 2024-09-03 |
| 12080702 | Method of fabricating package structure | Hsien-Wei Chen, Ming-Fa Chen | 2024-09-03 |
| 12074131 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sen-Bor Jan, Sung-Feng Yeh | 2024-08-27 |
| 12068717 | Photovoltaic array fault diagnosis method based on composite information | Fang Deng, Zelang Liang, Ning Ding, Xinyu Fan, Xin Gao +1 more | 2024-08-20 |
| 12068285 | Stacked die structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2024-08-20 |
| 12062608 | Semiconductor packages | Hsien-Wei Chen, Ming-Fa Chen | 2024-08-13 |
| 12038852 | Partial logical-to-physical (L2P) address translation table for multiple namespaces | Bo Fu, Lin Chen, Cheng-Yun Hsu | 2024-07-16 |
| 12032441 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2024-07-09 |
| 12009841 | Error recovery using adaptive LLR lookup table | Han Zhang, Chenrong Xiong | 2024-06-11 |
| 12009386 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Ming-Fa Chen | 2024-06-11 |
| 12009316 | Semiconductor structure and method of manufacturing a semiconductor structure | Hsien-Wen Liu, Hsien-Wei Chen | 2024-06-11 |
| 12002778 | Semiconductor packages and methods of forming the same | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2024-06-04 |
| 11996401 | Packaged die and RDL with bonding structures therebetween | Hsien-Wei Chen | 2024-05-28 |
| 11994986 | Valid data retrieval for garbage collection | Bo Fu | 2024-05-28 |
| 11973516 | Soft decoding correctable page assisted LLR estimation | Chenrong Xiong | 2024-04-30 |