Issued Patents All Time
Showing 26–50 of 395 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261163 | Molded dies in semiconductor packages and methods of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2025-03-25 |
| 12253861 | Multi-machining robot collaboration method in flexible hardware production workshop | Bin Xin, Sai Lu, Lihua DOU, Qing Wang, Miao Wang | 2025-03-18 |
| 12249142 | Method and an electronic apparatus for acquiring a floor map of a room layout | Juan Liu, Huasin Wang, Sukun YOON, Longhai WU | 2025-03-11 |
| 12243849 | Passives to facilitate mold compound flow | Chittranjan Mohan Gupta, Yiqi Tang, Rajen Manicon Murugan, Tianyi Luo | 2025-03-04 |
| 12224257 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen | 2025-02-11 |
| 12217143 | Resolving opaqueness of complex machine learning applications | Vijayan Nair, Agus Sudjianto, Kurt Schieding, Linwei Hu, Xiaoyu Liu +1 more | 2025-02-04 |
| 12218105 | Package and method of forming the same | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12218108 | Package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12212738 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2025-01-28 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Makarand Ramkrishna Kulkarni, Steven Kummerl | 2025-01-28 |
| 12205856 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Ching-Jung Yang | 2025-01-21 |
| 12205911 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen | 2025-01-21 |
| 12191283 | Manufacturing method of three-dimensional stacking structure | Hsien-Wei Chen, Ming-Fa Chen | 2025-01-07 |
| 12191259 | Multi-channel gate driver package with grounded shield metal | Yiqi Tang, Rajen Manicon Murugan | 2025-01-07 |
| 12185023 | Method and apparatus for generating video intermediate frame | Xin Jin, Guotao SHEN, Youxin CHEN, Longhai WU, Jayoon KOO +1 more | 2024-12-31 |
| 12176257 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Ming-Fa Chen | 2024-12-24 |
| 12174202 | Systems and methods for electrochemical point-of-care detection of hemoglobin | Donnie Smith, Brittney Werner, Gary L. Hughes | 2024-12-24 |
| 12165971 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2024-12-10 |
| 12165989 | Semiconductor package with electromagnetic interference shielding | Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2024-12-10 |
| 12154876 | Semiconductor interconnect structure and method | Hsien-Wei Chen | 2024-11-26 |
| D1052799 | Electronic cigarette | Zhengming Chen | 2024-11-26 |
| 12148728 | Multi-chip integrated fan-out package | Hsien-Wei Chen | 2024-11-19 |
| 12136464 | Soft decoding correctable page assisted reference voltage tracking | Chenrong Xiong | 2024-11-05 |
| 12128876 | Method and system for controlling four-wheel-independent-drive electric vehicle (4WID) EV | Jingbo Zhao | 2024-10-29 |
| 12125769 | Package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2024-10-22 |