Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8928162 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Shang-Ying Tsai, Chang-Yi Yang +1 more | 2015-01-06 |
| 8853801 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Jung-Huei Peng, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin | 2014-10-07 |
| 8841201 | Systems and methods for post-bonding wafer edge seal | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Lin-Min Hung, Yao-Te Huang +1 more | 2014-09-23 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Jung-Huei Peng, Hung-Hua Lin, Ming-Tung Wu, Ping-Yin Liu +2 more | 2014-05-27 |
| 8723343 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Shang-Ying Tsai, Chang-Yi Yang +1 more | 2014-05-13 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Yi-Chuan Teng +1 more | 2014-04-01 |
| 8674495 | Package systems having a eutectic bonding material and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Shang-Ying Tsai, Jung-Huei Peng | 2014-03-18 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hung-Hua Lin, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2014-02-11 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2013-11-12 |
| 8377798 | Method and structure for wafer to wafer bonding in semiconductor packaging | Jung-Huei Peng, Yao-Te Huang, Shang-Ying Tsai, Ping-Yin Liu | 2013-02-19 |