Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720487 | Structure and formation method of semiconductor device with magnetic element | Chin-Yu Ku, Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Chen-Shien Chen | 2020-07-21 |
| 10510661 | Semiconductor devices and methods of forming the same | Chen-Shien Chen, Chin-Yu Ku, Kuan-Chih Huang, Wei-Li Huang | 2019-12-17 |
| 10483226 | Semiconductor device and method of forming the same | Chin-Yu Ku, Chao-Yi Wang, Chen-Shien Chen, Chien-Hung Kuo | 2019-11-19 |
| 10319695 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo +3 more | 2019-06-11 |
| 10290697 | Magnetic core inductor semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Chien-Chih Chou, Chin-Yu Ku, Chen-Shien Chen | 2019-05-14 |
| 10276528 | Semicondcutor device and manufacturing method thereof | Chin-Yu Ku, Cheng-Lung Yang, Chen-Shien Chen, Chao-Yi Wang, Ching-Hui Chen +1 more | 2019-04-30 |
| 10276561 | Semiconductor structure with resistor layer and method for forming the same | I-Tseng Chen, Chun-Hsien Huang, Yu-Hung Lin | 2019-04-30 |
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Sheng-Pin Yang, Chen-Shien Chen, Chien-Chih Chou, Ting-Li Yang | 2019-04-23 |
| 10263064 | Semiconductor devices and methods of forming the same | Chin-Yu Ku, Chien-Chih Chou, Chen-Shien Chen, Chi-Cheng Chen, Kuang-Yi Wu | 2019-04-16 |
| 10163842 | Semiconductor structure and manufacturing method thereof | Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Sheng-Yu Wu, Ching-Hui Chen +1 more | 2018-12-25 |
| 10163781 | Semiconductor devices and methods of forming the same | Chen-Shien Chen, Chin-Yu Ku, Kuan-Chih Huang, Wei-Li Huang | 2018-12-25 |
| 10103042 | Chamber, semiconductor processing station, and semiconductor process using the same | Chia-Wei Lu, Hung-Chih Wang | 2018-10-16 |
| 10084032 | Semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Chien-Chih Chou, Chin-Yu Ku, Chen-Shien Chen | 2018-09-25 |
| 9773779 | Semiconductor structure with resistor layer and method for forming the same | I-Tseng Chen, Chun-Hsien Huang, Yu-Hung Lin | 2017-09-26 |
| 9589892 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu +1 more | 2017-03-07 |
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu +1 more | 2016-07-05 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Ching-Wen Hsiao, Kuo-Ching Hsu, Chen-Shien Chen | 2016-05-24 |
| 9287153 | Semiconductor baking apparatus and operation method thereof | Hsin-Kai Chen, Hung-Chih Wang, Shih-Chi Lin | 2016-03-15 |
| 9190347 | Die edge contacts for semiconductor devices | Yi-Jen Lai, You-Hua Chou, Huai-Tei Yang | 2015-11-17 |
| 8759949 | Wafer backside structures having copper pillars | Chen-Hua Yu, Kuo-Ching Hsu, Chen-Shien Chen | 2014-06-24 |
| 8736050 | Front side copper post joint structure for temporary bond in TSV application | Ching-Wen Hsiao, Kuo-Ching Hsu, Chen-Shien Chen | 2014-05-27 |
| 8541262 | Die edge contacts for semiconductor devices | Yi-Jen Lai, You-Hua Chou, Huai-Tei Yang | 2013-09-24 |
| 8461045 | Bond pad connection to redistribution lines having tapered profiles | Kuo-Ching Hsu, Chen-Shien Chen | 2013-06-11 |
| 8158489 | Formation of TSV backside interconnects by modifying carrier wafers | Ching-Wen Hsiao, Kuo-Ching Hsu, Chen-Shien Chen | 2012-04-17 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Ming-Hong Tseng, Kai-Ming Ching, Chen-Shien Chen, Ching-Wen Hsiao, Tsung-Ding Wang | 2012-01-17 |