Issued Patents All Time
Showing 51–52 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928534 | Bond pad connection to redistribution lines having tapered profiles | Kuo-Ching Hsu, Chen-Shien Chen | 2011-04-19 |
| 7633165 | Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV | Kuo-Ching Hsu, Chen-Shien Chen, Boe Su | 2009-12-15 |