Issued Patents All Time
Showing 76–100 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692813 | Semiconductor package with dummy bumps connected to non-solder mask defined pads | Shin-Puu Jeng | 2020-06-23 |
| 10665473 | Package structure and method of fabricating the same | Chia-Hsiang Lin, Shuo-Mao Chen, Shin-Puu Jeng, Arunima Banerjee | 2020-05-26 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2020-04-28 |
| 10622336 | Manufacturing method of semiconductor package | Jui-Pin Hung, Shin-Puu Jeng | 2020-04-14 |
| 10546830 | Chip package structure | Shin-Puu Jeng, Shuo-Mao Chen | 2020-01-28 |
| 10535632 | Semiconductor package structure and method of manufacturing the same | Shin-Puu Jeng, Shuo-Mao Chen | 2020-01-14 |
| 10535597 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Shin-Puu Jeng | 2020-01-14 |
| 10515930 | Three-layer package-on-package structure and method forming same | Jui-Pin Hung, Shin-Puu Jeng | 2019-12-24 |
| 10515827 | Method for forming chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Shuo-Mao Chen, Techi Wong | 2019-12-24 |
| 10504752 | Integrated passive device package and methods of forming same | Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng | 2019-12-10 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10475769 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Shin-Puu Jeng | 2019-11-12 |
| 10354982 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2019-07-16 |
| 10283428 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2019-05-07 |
| 10283474 | Chip package structure and method for forming the same | Shin-Puu Jeng, Shuo-Mao Chen | 2019-05-07 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10163876 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Jui-Pin Hung | 2018-12-25 |
| 10163860 | Semiconductor package structure | Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng | 2018-12-25 |
| 10083946 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2018-09-25 |
| 10050024 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Shuo-Mao Chen, Shin-Puu Jeng | 2018-08-14 |
| 10020275 | Semiconductive packaging device and manufacturing method thereof | Jing-Cheng Lin | 2018-07-10 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Jui-Pin Hung, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2018-06-12 |
| 9985006 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Jui-Pin Hung | 2018-05-29 |
| 9947629 | Method of forming contact holes in a fan out package | Szu-Wei Lu, Jing-Cheng Lin | 2018-04-17 |
| 9935080 | Three-layer Package-on-Package structure and method forming same | Jui-Pin Hung, Shin-Puu Jeng | 2018-04-03 |