FH

Feng-Cheng Hsu

TSMC: 110 patents #224 of 12,232Top 2%
📍 New Taipei, TW: #28 of 10,472 inventorsTop 1%
Overall (All Time): #11,850 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 101–110 of 110 patents

Patent #TitleCo-InventorsDate
9911629 Integrated passive device package and methods of forming same Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng 2018-03-06
9633895 Integrated fan-out structure with guiding trenches in buffer layer Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin 2017-04-25
9627346 Underfill pattern with gap Hou-Ju Huang, Szu-Wei Lu, Jing-Cheng Lin 2017-04-18
9425121 Integrated fan-out structure with guiding trenches in buffer layer Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin 2016-08-23
9379041 Fan out package structure Szu-Wei Lu, Jing-Cheng Lin 2016-06-28
9323155 Double patterning strategy for contact hole and trench in photolithography Chun-Kuang Chen, Hsiao-Wei Yeh, Chih-An Lin, Chien-Wei Wang 2016-04-26
8741552 Double patterning strategy for contact hole and trench in photolithography Chun-Kuang Chen, Hsiao-Wei Yeh, Chih-An Lin, Chien-Wei Wang 2014-06-03
8450052 Double patterning strategy for contact hole and trench in photolithography Jian-Hong Chen 2013-05-28
8048616 Double patterning strategy for contact hole and trench in photolithography Jian-Hong Chen 2011-11-01
7935477 Double patterning strategy for contact hole and trench Chun-Kuang Chen 2011-05-03