DY

Dun-Nian Yaung

TSMC: 524 patents #7 of 12,232Top 1%
Overall (All Time): #344 of 4,157,543Top 1%
525
Patents All Time

Issued Patents All Time

Showing 401–425 of 525 patents

Patent #TitleCo-InventorsDate
8766387 Vertically integrated image sensor chips and methods for forming the same Jeng-Shyan Lin, Feng-Chi Hung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more 2014-07-01
8736006 Backside structure for a BSI image sensor device Shuang-Ji Tsai, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin, Chun-Chieh Chuang +1 more 2014-05-27
8710612 Semiconductor device having a bonding pad and shield structure of different thickness Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Jeng-Shyan Lin, Cheng-Ying Ho 2014-04-29
8709854 Backside structure and methods for BSI image sensors Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2014-04-29
8710607 Method and apparatus for image sensor packaging Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu 2014-04-29
8704277 Spectrally efficient photodiode for backside illuminated sensor Tzu-Hsuan Hsu 2014-04-22
8685820 Multiple gate dielectric structures and methods of forming the same Hsiao-Hui Tseng, Jen-Cheng Liu, Wen-I Hsu, Min-Feng Kao 2014-04-01
8674469 Isolation structure for backside illuminated image sensor Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, An-Chun Tu 2014-03-18
8674467 Image sensor and method of fabricating same Wen-De Wang, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin 2014-03-18
8669135 System and method for fabricating a 3D image sensor structure Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang 2014-03-11
8664736 Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same Shuang-Ji Tsai, Jen-Cheng Liu, Jeng-Shyan Lin, Wen-De Wang, Yueh-Chiou Lin 2014-03-04
8629523 Inserted reflective shield to improve quantum efficiency of image sensors Yu-Hao Shih, Szu-Ying Chen, Hsing-Lung Chen, Jen-Cheng Liu, Volume Chien 2014-01-14
8629524 Apparatus for vertically integrated backside illuminated image sensors Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Ping-Yin Liu, Lan-Lin Chao 2014-01-14
8624311 Method and structure to reduce dark current in image sensors Chun-Chieh Chuang, Chih-Min Lin, Ken Wen-Chien Fu 2014-01-07
8614495 Back side defect reduction for back side illuminated image sensor Chun-Chieh Chuang, Yeur-Luen Tu, Jen-Cheng Liu, Keng-Yu Chou, Chung Chien Wang 2013-12-24
8604405 Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same Han-Chi Liu, Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Chun-Chieh Chuang 2013-12-10
8586404 Method for reducing contact resistance of CMOS image sensor Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, An-Chun Tu 2013-11-19
8564085 CMOS image sensor structure Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Wen-De Wang 2013-10-22
8558351 Alignment for backside illumination sensor Jen-Cheng Liu, Shou-Gwo Wuu 2013-10-15
8531565 Front side implanted guard ring structure for backside illuminated image sensor Wen-De Wang, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin 2013-09-10
8525286 Method of making wafer structure for backside illuminated color image sensor Tzu-Hsuan Hsu, Chris Hsieh, Chung-Yi Yu 2013-09-03
8513587 Image sensor with anti-reflection layer and method of manufacturing the same Tzu-Jui Wang, Hsiao-Hui Tseng, Wei-Cheng Hsu, Jen-Cheng Liu 2013-08-20
8502389 CMOS image sensor and method for forming the same Cheng-Ying Ho, Jen-Cheng Liu, Jeng-Shyan Lin, Wen-De Wang, Shih Pei Chou 2013-08-06
8460979 Method of fabricating a backside illuminated image sensor Jhy-Ming Hung, Jen-Cheng Liu 2013-06-11
8461021 Multiple seal ring structure Jen-Cheng Liu, Jen-Shyan Lin, Wen-De Wang, Shu-Ting Tsai 2013-06-11