Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9586811 | Semiconductor devices with moving members and methods for making the same | Chia-Hua Chu, Kuei-Sung Chang | 2017-03-07 |
| 9581512 | Pressure sensor with deformable membrane and method of manufacture | Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Su +1 more | 2017-02-28 |
| 9550666 | MEMS device with release aperture | Chia-Hua Chu, Chun-Wen Cheng | 2017-01-24 |
| 9499396 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee | 2016-11-22 |
| 9452924 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2016-09-27 |
| 9450109 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2016-09-20 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-05-10 |
| 9140578 | Measurement device | Deng-Mao Wang, Chong-Xian Su | 2015-09-22 |
| 9133017 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Te-Hao Lee, Chia-Hua Chu | 2015-09-15 |
| 9134141 | Measurement device | Deng-Mao Wang, Chong-Xian Su, Shou-Long Yu, Chao-Yun Chen | 2015-09-15 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Kai-Chih Liang, Chun-Wen Cheng | 2015-04-14 |
| 8987059 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee | 2015-03-24 |
| 8962367 | MEMS device with release aperture | Chia-Hua Chu, Chun-Wen Cheng | 2015-02-24 |
| 8887573 | MEMS vacuum level monitor in sealed package | Tung-Tsun Chen, Jui-Cheng Huang | 2014-11-18 |
| 8797127 | MEMS switch with reduced dielectric charging effect | Chia-Hua Chu, Chun-Wen Cheng | 2014-08-05 |
| 8763220 | Method of manufacturing a MEMS device | Tien-Kan Chung, Yao-Te Huang, Chia-Hua Chu, Chia-Ming Hung, Wen-Chuan Tai +1 more | 2014-07-01 |
| 8748205 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Te-Hao Lee, Chia-Hua Chu | 2014-06-10 |
| 8729646 | MEMS devices and methods for forming the same | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2014-05-20 |
| 8716051 | MEMS device with release aperture | Chia-Hua Chu, Chun-Wen Cheng | 2014-05-06 |
| 8709849 | Wafer level packaging | Chun-Wen Cheng, Chia-Hua Chu | 2014-04-29 |
| 8704317 | Microstructure device with an improved anchor | Chun-Wen Cheng, Chia-Hua Chu, Yi Heng Tsai | 2014-04-22 |
| 8648468 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2014-02-11 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more | 2014-01-21 |
| 8629517 | Wafer level packaging | Chun-Wen Cheng, Chia-Hua Chu | 2014-01-14 |
| 8569808 | Temperature stabilitized MEMS | Tung-Tsun Chen, Chia-Hua Chu, Jui-Cheng Huang | 2013-10-29 |