Issued Patents All Time
Showing 51–75 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004740 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Hsin-Ping Chen, Hai-Ching Chen, Shau-Lin Shue | 2021-05-11 |
| 10991618 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Hsin-Ping Chen, Shau-Lin Shue | 2021-04-27 |
| 10957580 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2021-03-23 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang +2 more | 2021-02-23 |
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-12-29 |
| 10847418 | Formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2020-11-24 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2020-11-24 |
| 10818509 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2020-10-27 |
| 10784151 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Tai-I Yang | 2020-09-22 |
| 10784155 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Cheng-Chi Chuang | 2020-09-22 |
| 10777452 | Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via | Po-Kuan HO | 2020-09-15 |
| 10734275 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2020-08-04 |
| 10535560 | Interconnection structure of semiconductor device | Wei-Chen Chu, Hsiang-Wei Liu, Tai-I Yang | 2020-01-14 |
| 10529617 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2020-01-07 |
| 10522469 | Split rail structures located in adjacent metal layers | Hsiang-Wei Liu, Wei-Chen Chu | 2019-12-31 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Cheng-Chi Chuang | 2019-11-19 |
| 10475703 | Structure and formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2019-11-12 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2019-11-05 |
| 10276396 | Method for forming semiconductor device with damascene structure | Hsiang-Wei Liu, Wei-Chen Chu | 2019-04-30 |
| 10269715 | Split rail structures located in adjacent metal layers | Hsiang-Wei Liu, Wei-Chen Chu | 2019-04-23 |
| 10162930 | Method of adjusting metal line pitch | Wei-Cheng Lin, Kam-Tou Sio, Shih-Wei Peng, Hui-Ting Yang, Chih-Liang Chen +3 more | 2018-12-25 |
| 10163654 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2018-12-25 |
| 10163690 | 2-D interconnections for integrated circuits | Hsiang-Wei Liu, Tai-I Yang, Wei-Chen Chu | 2018-12-25 |
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin, Tien-I Bao | 2018-10-16 |