Issued Patents All Time
Showing 1–25 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396255 | Multiple back side/buried power rail (BPR) cell including field-effect transistors with air void between two adjacent BPR cells | Te-Hsin Chiu, Jiann-Tyng Tzeng | 2025-08-19 |
| 12388013 | Three dimensional integrated circuit with monolithic inter-tier vias (MIV) | Shih-Wei Peng, Jiann-Tyng Tzeng, Wei-Cheng Lin, Wei-An Lai | 2025-08-12 |
| 12334179 | Cell structures and power routing for integrated circuits | Shih-Wei Peng, Jiann-Tyng Tzeng | 2025-06-17 |
| 12336296 | Semiconductor device including source/drain contact having height below gate stack | Charles Chew-Yuen Young, Chih-Liang Chen, Chih-Ming Lai, Jiann-Tyng Tzeng, Shun Li Chen +3 more | 2025-06-17 |
| 12327786 | Decoupling capacitors with back side power rails | Jiann-Tyng Tzeng | 2025-06-10 |
| 12315861 | Integrated circuit structure and method for manufacturing the same | Wei Ling Chang, Lee-Chung Lu, Xiangdong Chen, Hsiang-Chi Huang | 2025-05-27 |
| 12278230 | Method of manufacturing conductors for semiconductor device | Chih-Liang Chen, Hui-Ting Yang, Shun Li Chen, Ko-Bin Kao, Chih-Ming Lai +2 more | 2025-04-15 |
| 12261113 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2025-03-25 |
| 12261115 | Semiconductor devices and methods of manufacturing thereof | Jiann-Tyng Tzeng | 2025-03-25 |
| 12255203 | Monolithic three dimensional integrated circuit | Jiann-Tyng Tzeng, Shih-Wei Peng | 2025-03-18 |
| 12230624 | Integrated circuit with mixed row heights | Jiann-Tyng Tzeng, Chung-Hsing Wang, Yi-Kan Cheng | 2025-02-18 |
| 12218050 | Manufacturing method for semiconductor device | Te-Hsin Chiu, Wei-An Lai, Meng-Hung Shen, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2025-02-04 |
| 12219748 | Semiconductor device including a dielectric layer between a source/drain region and a substrate | Yi-Hsun Chiu | 2025-02-04 |
| 12170277 | Integrated circuit and manufacturing method of the same | Jiann-Tyng Tzeng | 2024-12-17 |
| 12148754 | Integrated circuit structure with hybrid cell design | Jiann-Tyng Tzeng | 2024-11-19 |
| 12132049 | Integrated circuit device with high mobility and system of forming the integrated circuit | Shang-Wei Fang, Jiann-Tyng Tzeng, CHEW-YUEN YOUNG | 2024-10-29 |
| 12131998 | Integrated circuit, system and method of forming same | Te-Hsin Chiu, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-10-29 |
| 12113014 | Integrated circuit including supervia and method of making | Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-10-08 |
| 12107045 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2024-10-01 |
| 12039246 | Circuit layout | Shih-Wei Peng, Jiann-Tyng Tzeng | 2024-07-16 |
| 12034076 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Hui-Ting Yang, Wei-Cheng Lin +3 more | 2024-07-09 |
| 12021083 | Fin field-effect transistor and method of forming the same | Te-Hsin Chiu, Jiann-Tyng Tzeng | 2024-06-25 |
| 11984443 | Power distribution network | Jiann-Tyng Tzeng, Wei-Cheng Lin | 2024-05-14 |
| 11942413 | Decoupling capacitors with back side power rails | Jiann-Tyng Tzeng | 2024-03-26 |
| 11935825 | Contact structure, method, layout, and system | Cheng-Chi Chuang, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin, Lipen Yuan | 2024-03-19 |