Issued Patents All Time
Showing 51–75 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532751 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Shih-Wei Peng +2 more | 2022-12-20 |
| 11515308 | Integrated circuit structure with hybrid cell design | Jiann-Tyng Tzeng | 2022-11-29 |
| 11495497 | FinFET switch | Chih-Liang Chen, Charles Chew-Yuen Young, Ho Che Yu | 2022-11-08 |
| 11444073 | Power distribution network | Jiann-Tyng Tzeng, Wei-Cheng Lin | 2022-09-13 |
| 11437998 | Integrated circuit including back side conductive lines for clock signals | Jiun-Wei Lu | 2022-09-06 |
| 11282829 | Integrated circuit with mixed row heights | Jiann-Tyng Tzeng, Chung-Hsing Wang, Yi-Kan Cheng | 2022-03-22 |
| 11270936 | Integrated circuit including supervia and method of making | Jiann-Tyng Tzeng, Wei-Cheng Lin | 2022-03-08 |
| 11239244 | Partial buried insulator nano-sheet device | Yi-Hsun Chiu | 2022-02-01 |
| 11222899 | Semiconductor device which includes fins and method of making same | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng, Jiann-Tyng Tzeng +3 more | 2022-01-11 |
| 11222157 | Pin access hybrid cell height design | Jiann-Tyng Tzeng | 2022-01-11 |
| 11158580 | Semiconductor devices with backside power distribution network and frontside through silicon via | Cheng-Chi Chuang, Chia-Tien Wu, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-Cheng Lin | 2021-10-26 |
| 11152348 | Integrated circuit with mixed row heights | Jiann-Tyng Tzeng, Jack Liu, Yi-Chuin Tsai, Shang-Wei Fang, Sing-Kai Huang +1 more | 2021-10-19 |
| 11121256 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Hui-Ting Yang, Wei-Cheng Lin +3 more | 2021-09-14 |
| 11088092 | Via rail solution for high power electromigration | Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-08-10 |
| 11063005 | Via rail solution for high power electromigration | Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-07-13 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +4 more | 2021-06-22 |
| 11024579 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-06-01 |
| 10978439 | Method and system of manufacturing conductors and semiconductor device which includes conductors | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang, Ko-Bin Kao +2 more | 2021-04-13 |
| 10977421 | System for and method of manufacturing an integrated circuit | Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +3 more | 2021-04-13 |
| 10971493 | Integrated circuit device with high mobility and system of forming the integrated circuit | Shang-Wei Fang, Jiann-Tyng Tzeng, CHEW-YUEN YOUNG | 2021-04-06 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2021-03-16 |
| 10937695 | FinFET switch | Chih-Liang Chen, Charles Chew-Yuen Young, Ho Che Yu | 2021-03-02 |
| 10879229 | Integrated circuit, system for and method of forming an integrated circuit | Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Jiann-Tyng Tzeng, Yi-Hsun Chiu | 2020-12-29 |
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +4 more | 2020-12-29 |
| 10879173 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2020-12-29 |