Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901190 | Method of patterning | Yu-Tien Shen, Wei-Liang Lin, Chih-Ming Lai, Kuo-Cheng Ching, Shi Ning Ju +2 more | 2024-02-13 |
| 11848208 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2023-12-19 |
| 11616067 | Method of making semiconductor device which includes Fins | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2023-03-28 |
| 11532482 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hsin-Chih Chen +6 more | 2022-12-20 |
| 11437239 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2022-09-06 |
| 11222899 | Semiconductor device which includes fins and method of making same | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2022-01-11 |
| 11081354 | Fin patterning methods for increased process margins | Wei-Liang Lin, Li-Te Lin, Ru-Gun Liu, Min Cao | 2021-08-03 |
| 10971363 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2021-04-06 |
| 10957551 | Fin-like field effect transistor patterning methods for increasing process margins | Wei-Liang Lin, Hsin-Chih Chen, Shi Ning Ju, Ken-Hsien Hsieh, Yung-Sung Yen +1 more | 2021-03-23 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hsin-Chih Chen +6 more | 2021-03-16 |
| 10714485 | Semiconductor device which includes Fins | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2020-07-14 |
| 10535520 | Fin patterning methods for increased process margins | Wei-Liang Lin, Li-Te Lin, Ru-Gun Liu, Min Cao | 2020-01-14 |
| 10497565 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2019-12-03 |
| 10446406 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hsin-Chih Chen +6 more | 2019-10-15 |
| 10418252 | Fin-like field effect transistor patterning methods for increasing process margins | Wei-Liang Lin, Hsin-Chih Chen, Shi Ning Ju, Ken-Hsien Hsieh, Yung-Sung Yen +1 more | 2019-09-17 |
| 10312109 | Lithographic technique incorporating varied pattern materials | Chi-Cheng Hung, Chun-Kuang Chen, De-Fang Chen, Ru-Gun Liu, Tsai-Sheng Gau +1 more | 2019-06-04 |
| 10074657 | Method of manufacturing fins and semiconductor device which includes fins | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2018-09-11 |
| 9991132 | Lithographic technique incorporating varied pattern materials | Chi-Cheng Hung, Chun-Kuang Chen, De-Fang Chen, Ru-Gun Liu, Tsai-Sheng Gau +1 more | 2018-06-05 |
| 9679994 | High fin cut fabrication process | L. C. Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +3 more | 2017-06-13 |
| 9672320 | Method for integrated circuit manufacturing | Shih-Ming Chang, Chien-Fu Lee | 2017-06-06 |
| 9530660 | Multiple directed self-assembly patterning process | Chi-Cheng Hung, Chun-Kuang Chen, Kuan-Hsin Lo, Ru-Gun Liu, Tsai-Sheng Gau +1 more | 2016-12-27 |
| 9449880 | Fin patterning methods for increased process margin | Chi-Cheng Hung, Chun-Kuang Chen, Chih-Ming Lai, Huan-Just Lin, Ru-Gun Liu +2 more | 2016-09-20 |