Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984355 | Method for manufacturing an interconnection structure having a bottom via spacer | Chia-Tien Wu | 2024-05-14 |
| 11488861 | Method for manufacturing an interconnect structure having a selectively formed bottom via | Chia-Tien Wu | 2022-11-01 |
| 10777452 | Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via | Chia-Tien Wu | 2020-09-15 |