Issued Patents All Time
Showing 251–264 of 264 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7125802 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Yi-Lung Cheng, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2006-10-24 |
| 7122471 | Method for preventing voids in metal interconnects | Jung-Chih Tsao, Si-Kua Cheng, Che-Tsao Wang, Steven Lin, Hsien-Ping Feng +1 more | 2006-10-17 |
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Jung-Chih Tsao, Jchung-Chang Chen, Shih-Tzung Chang, Shih-Ho Lin +2 more | 2006-07-04 |
| 7030016 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng +2 more | 2006-04-18 |
| 6979656 | Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same | Shiu-Ko JangJian, Jun Wu, Ying-Lung Wang, Yi-Lung Cheng, Michael Chang +1 more | 2005-12-27 |
| 6903011 | Displacement method to grow cu overburden | Ying-Lang Wang | 2005-06-07 |
| 6903019 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Yi-Lung Cheng, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2005-06-07 |
| 6825120 | Metal surface and film protection method to prolong Q-time after metal deposition | Ying-Lang Wang | 2004-11-30 |
| 6705923 | Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using | Ying Wan | 2004-03-16 |
| 6673661 | Self-aligned method for forming dual gate thin film transistor (TFT) device | Ting-Chang Chang, Po-Tsun Liu, Ying-Lang Wang | 2004-01-06 |
| 6670274 | Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure | Ying-Lang Wang | 2003-12-30 |
| 6660638 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Yi-Lung Cheng, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2003-12-09 |
| 6211024 | Method for forming a semiconductor device by using multiple ion implantation sequence to reduce crystal defects and to allow the reduction of the temperature used for a subsequent rapid thermal anneal procedure | Kou-Yu Chou | 2001-04-03 |
| 6156660 | Method of planarization using dummy leads | Chia-Shiung Tsai, Jing-Meng Liu, Tsu Shih | 2000-12-05 |