Issued Patents All Time
Showing 76–100 of 131 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964746 | Deep trench isolation shrinkage method for enhanced device performance | Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2021-03-30 |
| 10879288 | Reflector for backside illuminated (BSI) image sensor | Chih-Hui Huang, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2020-12-29 |
| 10868058 | Photodiode gate dielectric protection layer | Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu, Yeur-Luen Tu | 2020-12-15 |
| 10734285 | Bonding support structure (and related process) for wafer stacking | Sheng-Chan Li, Cheng-Yuan Tsai, Chih-Hui Huang, Kuo-Ming Wu | 2020-08-04 |
| 10658409 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, I-Nan Chen, Tzu-Hsiang Chen, Yu-Jen Wang, Yen-Ting Chiang +1 more | 2020-05-19 |
| 10622401 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Min-Feng Kao | 2020-04-14 |
| 10541297 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, I-Nan Chen, Sheng-Chau Chen, Cheng-Yuan Tsai | 2020-01-21 |
| 10526703 | Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities | Chih-Hui Huang, Sheng-Chan Li, Cheng-Yuan Tsai | 2020-01-07 |
| 10522514 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen | 2019-12-31 |
| 10522487 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Yuan Tsai +1 more | 2019-12-31 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Yung-Lung Lin, Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng | 2019-12-10 |
| 10325956 | Deep trench isolation shrinkage method for enhanced device performance | Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2019-06-18 |
| 10325949 | Image Sensor Device | Chao-Ching Chang, Sheng-Chan Li, Tsung-Wei Huang, Min-Hui Lin, Yi-Ming Lin | 2019-06-18 |
| 10319768 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Yuan Tsai, Keng-Yu Chou, Yeur-Luen Tu | 2019-06-11 |
| 10283550 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Min-Feng Kao | 2019-05-07 |
| 10204822 | Method for forming trench liner passivation | Hung-Ling Shih, Tsun-Kai Tsao, Ming-Huei Shen, Kuo-Hwa Tzeng, Yeur-Luen Tu | 2019-02-12 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Chih-Hui Huang, Yeur-Luen Tu | 2019-01-08 |
| 10164001 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, I-Nan Chen, Sheng-Chau Chen, Cheng-Yuan Tsai | 2018-12-25 |
| 10163947 | Photodiode gate dielectric protection layer | Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu, Yeur-Luen Tu | 2018-12-25 |
| 10074612 | Method for forming alignment marks and structure of same | Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai, Wei-Cheng Hsu +7 more | 2018-09-11 |
| 10050018 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen | 2018-08-14 |
| 10043841 | Image sensor device and method for forming the same | Chao-Ching Chang, Sheng-Chan Li, Tsung-Wei Huang, Min-Hui Lin, Yi-Ming Lin | 2018-08-07 |
| 10008530 | Image sensing device and manufacturing method thereof | Keng-Ying Liao, Chung-Bin Tseng, Jiech-Fun Lu, Po-Zen Chen, Yi-Hung Chen | 2018-06-26 |
| 10008531 | Varied STI liners for isolation structures in image sensing devices | Chia-Shiung Tsai, Feng-Chi Hung, Jiech-Fun Lu, Min-Feng Kao, Shih Pei Chou +1 more | 2018-06-26 |
| 9991303 | Image sensor device structure | Hung-Wen Hsu, Ching-Chung Su, Jiech-Fun Lu, Shih Pei Chou, Yeur-Luen Tu | 2018-06-05 |