Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12196779 | Probe system and machine apparatus thereof | MEI-TING LU, Sebastian Giessmann | 2025-01-14 |
| 11287475 | Method for compensating to distance between probe tip and device under test after temperature changes | Yu-Hsun Hsu, Chien-Hung Chen | 2022-03-29 |
| 11262401 | Wafer probe station | Chia-Hung Hung | 2022-03-01 |
| 11144198 | Control method of touch display apparatus | Chien-Hung Chen, Guan-Jhih Liou, Lin-Lin Chih | 2021-10-12 |
| 11036390 | Display method of display apparatus | Chien-Hung Chen, Guan-Jhih Liou, Lin-Lin Chih | 2021-06-15 |
| 10895587 | Wafer probe station | Yu-Hsun Hsu, Jhih-Wei Fang, Sebastian Giessmann | 2021-01-19 |
| 10312123 | Method for compensating probe misplacement and probe apparatus | Chen Chen, Yu-Hsun Hsu, Po-Yi Ting | 2019-06-04 |
| 10096505 | Wafer cassette | Lin-Lin Chih, Chien-Hung Chen, Cheng-Rong Yang | 2018-10-09 |
| 10048844 | Operating method for inspecting equipment | Yung-Chin Liu, Andrej Rumiantsev, YAO-CHUAN CHIANG | 2018-08-14 |
| 9632108 | Method for verifying a test substrate in a prober under defined thermal conditions | Michael Teich, Hans-Jurgen Fleischer | 2017-04-25 |
| 9395411 | Method for testing a test substrate under defined thermal conditions and thermally conditionable prober | Joerg Kiesewetter, Michael Teich, Karsten Stoll, Axel Schmidt | 2016-07-19 |
| 9373533 | Systems and methods for providing wafer access in a wafer processing system | Frank Fehrmann, Botho Hirschfeld | 2016-06-21 |
| 9194885 | Modular prober and method for operating same | Botho Hirschfeld, Axel Becker, Ulf Hackius | 2015-11-24 |
| 9110131 | Method and device for contacting a row of contact areas with probe tips | Claus Dietrich, Frank Fehrmann, Botho Hirschfeld | 2015-08-18 |
| 8922229 | Method for measurement of a power device | Botho Hirschfeld | 2014-12-30 |
| 8692567 | Method for verifying a test substrate in a prober under defined thermal conditions | Michael Teich, Hans-Jurgen Fleischer | 2014-04-08 |
| 8680879 | Chuck for supporting and retaining a test substrate and a calibration substrate | Andrej Rumiantsev, Steffen Schott, Karsten Stoll | 2014-03-25 |
| 8497693 | Method for testing a test substrate under defined thermal conditions and thermally conditionable prober | Joerg Kiesewetter, Michael Teich, Karsten Stoll, Axel Schmidt | 2013-07-30 |
| 8402848 | Probe holder | Joerg Kiesewetter, Stefan Kreissig | 2013-03-26 |
| 8368413 | Method for testing electronic components of a repetitive pattern under defined thermal conditions | Frank Fehrmann, Jens Fiedler, Claus Dietrich, Jorg Kiesewetter | 2013-02-05 |
| 8344744 | Probe station for on-wafer-measurement under EMI-shielding | Axel Schmidt, Botho Hirschfeld, Andrej Rumiantsev, Michael Teich | 2013-01-01 |
| 8278951 | Probe station for testing semiconductor substrates and comprising EMI shielding | Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus | 2012-10-02 |
| 8240650 | Chuck with triaxial construction | Michael Teich, Karsten Stoll, Axel Schmidt, Jorg Kiesewetter | 2012-08-14 |
| 7999563 | Chuck for supporting and retaining a test substrate and a calibration substrate | Andrej Rumiantsev, Steffen Scott, Karsten Stoll | 2011-08-16 |
| 7859278 | Probe holder for a probe for testing semiconductor components | Dietmar Runge, Claus Dietrich | 2010-12-28 |