Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8091601 | Equipment for bonding by molecular adhesion | Carine Duret, Alexandre Vaufredaz, Frederic Metral | 2012-01-10 |
| 8003493 | Method of splitting a substrate | Nadia Ben Mohamed | 2011-08-23 |
| 7977747 | Composite substrate and method of fabricating the same | Frédéric Allibert | 2011-07-12 |
| 7972939 | Transfer method with a treatment of a surface to be bonded | Christophe Maleville, Fabrice Letertre, Olivier Rayssac | 2011-07-05 |
| 7892951 | SOI substrates with a fine buried insulating layer | Didier Landru | 2011-02-22 |
| 7863158 | Treatment for bonding interface stabilization | Eric Neyret | 2011-01-04 |
| 7740735 | Tools and methods for disuniting semiconductor wafers | Yves-Matthieu Le Vaillant | 2010-06-22 |
| 7736993 | Composite substrate and method of fabricating the same | Frédéric Allibert | 2010-06-15 |
| 7645682 | Bonding interface quality by cold cleaning and hot bonding | Willy Michel, Walter Schwarzenbach, Daniel Delprat | 2010-01-12 |
| 7615464 | Transfer method with a treatment of a surface to be bonded | Christophe Maleville, Fabrice Letertre, Olivier Rayssac | 2009-11-10 |
| 7601271 | Process and equipment for bonding by molecular adhesion | Carine Duret, Alexandre Vaufredaz, Frederic Metral | 2009-10-13 |
| 7449395 | Method of fabricating a composite substrate with improved electrical properties | Frédéric Allibert | 2008-11-11 |
| 7446019 | Method of reducing roughness of a thick insulating layer | Nicolas Daval, Cecile Aulnette | 2008-11-04 |
| 7419884 | Method of bonding two wafers of semiconductor materials | — | 2008-09-02 |
| 7235461 | Method for bonding semiconductor structures together | Christophe Maleville, Corinne Maunand Tussot, Olivier Rayssac, Benjamin Scarfogliere, Hubert Moriceau +1 more | 2007-06-26 |
| 7232739 | Multifunctional metallic bonding | Fabrice Letertre, Christophe Morales, Hubert Moriceau | 2007-06-19 |
| 7189632 | Multifunctional metallic bonding | Fabrice Letertre, Christophe Morales, Hubert Moriceau | 2007-03-13 |
| 7187162 | Tools and methods for disuniting semiconductor wafers | Yves Mathieu Le Vaillant | 2007-03-06 |