Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488860 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Kwang-Jin Moon, Ju Bin SEO, Atsushi Fujisaki | 2022-11-01 |
| 11444014 | Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same | Jinho Chun, Jin Ho An, Teahwa Jeong, Jeonggi Jin, Atsushi Fujisaki | 2022-09-13 |
| 11302660 | Semiconductor devices and semiconductor packages including the same | Un-Byoung Kang, Jin Ho An, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2022-04-12 |
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Pil-Kyu Kang, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 11094612 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Kwang-Jin Moon, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2021-08-17 |
| 11043445 | Semiconductor device having a through silicon via and methods of manufacturing the same | Ju Bin SEO, Su-Jeong Park, Tae-Seong Kim, Kwang-Jin Moon, Dong-Chan Lim | 2021-06-22 |
| 11018101 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Kwang-Jin Moon, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2021-05-25 |
| 11004814 | Semiconductor device | Kwangjin Moon, Sujeong Park, Jubin Seo, Jin Ho An, Dong-Chan Lim +1 more | 2021-05-11 |
| 10872869 | Semiconductor devices and methods of manufacturing the same | Jeonggi Jin, Teahwa Jeong, Atsushi Fujisaki | 2020-12-22 |
| 10777487 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park, Byung-Lyul Park | 2020-09-15 |
| 10763163 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Kwang-Jin Moon, Ju Bin SEO, Atsushi Fujisaki | 2020-09-01 |
| 10325869 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Kwang-Jin Moon, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2019-06-18 |
| 10128168 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park, Byung-Lyul Park | 2018-11-13 |
| 10049997 | Semiconductor device and method of fabricating the same | Hyoju Kim, Kwangjin Moon, Sujeong Park, Jubin Seo, Naein Lee +1 more | 2018-08-14 |
| 10020273 | Semiconductor devices and methods of forming the same | Hyoju Kim, Byunglyul Park, Yeun-Sang Park, Jubin Seo, Atsushi Fujisaki | 2018-07-10 |
| 9831202 | Semiconductor devices with solder-based connection terminals and method of forming the same | Sun-kyoung Seo, Seung-Kwan Ryu, Tae-Je Cho, Yong-Hwan Kwon | 2017-11-28 |
| 9735090 | Integrated circuit devices having through-silicon vias and methods of manufacturing such devices | Atsushi Fujisaki, Byung-Iyul Park, Ji-Soon Park, Joo-Hee Jang, Jeong-gi Jin | 2017-08-15 |
| 9728490 | Semiconductor devices and methods of manufacturing the same | Hyo Ju Kim, Yeun-Sang Park, Atsushi Fujisaki, Kwang-Jin Moon, Byung-Lyul Park | 2017-08-08 |
| 9543200 | Methods for fabricating semiconductor devices having through electrodes | Kunsang Park, Sukyoung Kim, Jisoon Park, Byung-Lyul Park, Gilheyun Choi | 2017-01-10 |
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Taeyeong Kim, Yeun-Sang Park, Dosun Lee +3 more | 2016-12-27 |
| 9461007 | Wafer-to-wafer bonding structure | Jin-ho Chun, Pil-Kyu Kang, Byung-Lyul Park, Jae-Hwa Park | 2016-10-04 |
| 9219035 | Integrated circuit chips having vertically extended through-substrate vias therein | Ho-Jin Lee, Kang-Wook Lee, Myeong-Soon Park, Son-Kwan Hwang | 2015-12-22 |
| 9082680 | Joint structures having organic preservative films | Jeong-gi Jin, Ui-Hyoung Lee, Hyung Seok Kim, Jeong Woo Park | 2015-07-14 |
| 9006902 | Semiconductor devices having through silicon vias and methods of fabricating the same | Su Kyoung Kim, Kun-Sang Park, Seong Min Son, Jin Ho An, Do-Sun Lee | 2015-04-14 |
| 8987869 | Integrated circuit devices including through-silicon-vias having integral contact pads | Jeong-gi Jin, Jeong Woo Park | 2015-03-24 |