Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694965 | Fan-out semiconductor package | Changbo Lee, Joonseok Oh | 2023-07-04 |
| 11121090 | Fan-out semiconductor package | Changbo Lee, Joonseok Oh | 2021-09-14 |
| D859390 | Cover for an electronic device | Kangho Park, Bora Han, Sehan Kim, Yoonha Paick, Bongkyu Song +2 more | 2019-09-10 |
| 10020273 | Semiconductor devices and methods of forming the same | Ju-Il Choi, Hyoju Kim, Yeun-Sang Park, Jubin Seo, Atsushi Fujisaki | 2018-07-10 |
| 9806004 | Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad | Ho-Jin Lee, Jisoon Park, Jinho An | 2017-10-31 |
| 9799619 | Electronic device having a redistribution area | Jeonggi Jin, Kyu-Ha Lee, Jinho Chun, Jinho An | 2017-10-24 |
| 6709970 | Method for creating a damascene interconnect using a two-step electroplating process | Chankeun Park, Sangrok Hah, Juhyuck Chung, Hongseong Son | 2004-03-23 |