Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8872306 | Electrical interconnection structures including stress buffer layers | Jeonggi Jin, Jeong Woo Park | 2014-10-28 |
| 8816499 | Electrical interconnections of semiconductor devices and methods for fabricating the same | Jeong Woo Park, Jeonggi Jin, Yeun-Sang Park | 2014-08-26 |
| 8778776 | Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same | Kyu-Ha Lee, Jae-hyun Phee, Jung-Hwan Kim, Tae Hong Min | 2014-07-15 |
| 8629059 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein | Ho-Jin Lee, Kang-Wook Lee, Myeong-Soon Park, Son-Kwan Hwang | 2014-01-14 |
| 8575760 | Semiconductor devices having electrodes | Jae-hyun Phee, Uihyouong Lee, Jung-Hwan Kim | 2013-11-05 |
| 8564102 | Semiconductor device having through silicon via (TSV) | Jae-hyun Phee, Kyu-Ha Lee, Ho-Jin Lee, Son-Kwan Hwang | 2013-10-22 |
| 8513802 | Multi-chip package having semiconductor chips of different thicknesses from each other and related device | Keum-Hee Ma, Woo-Dong Lee, Min-Seung Yoon, Sang-Sick Park, Son-Kwan Hwang | 2013-08-20 |
| 8482129 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Hyun-Soo Chung, Son-Kwan Hwang | 2013-07-09 |
| 8088648 | Method of manufacturing a chip stack package | Cha-Jea Jo, Myung-Kee Chung, Nam-Seog Kim, In-Young Lee, Seok Ho Kim +2 more | 2012-01-03 |
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Dong-Ho Lee, Seong-Deok Hwang | 2011-10-18 |
| 7897511 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Hyun-Soo Chung, Son-Kwan Hwang | 2011-03-01 |
| 7875552 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby | Ho-Jin Lee, Kang-Wook Lee, Myeong-Soon Park, Son-Kwan Hwang | 2011-01-25 |
| 7767576 | Wafer level package having floated metal line and method thereof | Hyun-Soo Chung, Seung-Duk Baek, Dong-Ho Lee | 2010-08-03 |
| 7544538 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Dong-Ho Lee, Seong-Deok Hwang | 2009-06-09 |