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Computed tomography using intersecting views of plasma using optical emission spectroscopy during plasma processing |
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Feature etching using varying supply of power pulses |
Xiang Hu, Gabriel Padron Wells, Jack Chao-Hsu Chang, Mingmei Wang |
2016-07-26 |
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Semiconductor structures with coplanar recessed gate layers and fabrication methods |
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Integrated circuits having replacement metal gates with improved threshold voltage performance and methods for fabricating the same |
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Integrated circuits having laterally confined epitaxial material overlying fin structures and methods for fabricating same |
Xiang Hu, Jin Ping Liu, Jill C. Hildreth |
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Facilitating mask pattern formation |
Xiang Hu, Dae-Han Choi, Dae Geun Yang, Andy Wei |
2015-05-19 |
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Methods for fabricating integrated circuits with improved patterning schemes |
Xiang Hu, Hui Peng Koh |
2015-01-27 |
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In-situ photoresist strip during plasma etching of active hard mask |
Sangjun Cho, Tom Choi, Sean S. Kang, Prabhakara Gopaladasu, Bi-Ming Yen |
2014-12-16 |
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In-situ photoresist strip during plasma etching of active hard mask |
Sangjun Cho, Tom Choi, Sean S. Kang, Prabhakara Gopaladasu, Bi-Ming Yen |
2012-10-09 |
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Trilayer resist organic layer etch |
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2012-02-28 |
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Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chucking |
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2010-08-24 |
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Wafer area pressure control for plasma confinement |
David W. Benzing, Albert R. Ellingboe |
2008-12-30 |
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Waferless automatic cleaning after barrier removal |
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2007-05-01 |
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Pre-endpoint techniques in photoresist etching |
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Wafer area pressure control for plasma confinement |
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Wafer area pressure control for plasma confinement |
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