Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412810 | Single side via fill process for through-vias | Jon Thomas WOODYARD | 2025-09-09 |
| 12404597 | Electrochemical depositions of nanotwin copper materials | Jing Xu, John L. Klocke, Eric J. Bergman, Kwan Wook Roh | 2025-09-02 |
| 11987897 | Systems and methods for shielding features of a workpiece during electrochemical deposition | Eric J. Bergman, Jeffrey J. Dennison | 2024-05-21 |
| 11973034 | Nanotwin copper materials in semiconductor devices | Eric J. Bergman, John L. Klocke, Jing Xu, Kwan Wook Roh | 2024-04-30 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, John L. Klocke, Prayudi Lianto | 2024-02-13 |
| 11899376 | Methods for forming alignment marks | Prayudi Lianto, Liu Jiang, El Mehdi Bazizi, Guan Huei See | 2024-02-13 |
| 11875996 | Methods for electrochemical deposition of isolated seed layer areas | — | 2024-01-16 |
| 11634830 | Electrochemical depositions of nanotwin copper materials | Jing Xu, John L. Klocke, Eric J. Bergman, Kwan Wook Roh | 2023-04-25 |
| 11203816 | Electroplating seed layer buildup and repair | James C. Burnham, Robert Mikkola | 2021-12-21 |
| 10494731 | Electroplating dynamic edge control | Paul R. McHugh, Gregory J. Wilson, Daniel J. Woodruff | 2019-12-03 |
| 10373864 | Systems and methods for wetting substrates | Paul R. McHugh, Bridger Earl HOERNER, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal +3 more | 2019-08-06 |
| 9922874 | Methods of enhancing polymer adhesion to copper | Prayudi Lianto, Sam Lee, Charles Sharbono, Guan Huei See, Arvind Sundarrajan | 2018-03-20 |
| 9359683 | Method of forming metal and metal alloy features | Bioh Kim, Greg Wilson, Paul R. McHugh | 2016-06-07 |
| 7420690 | End point detection in workpiece processing | Daniel J. Woodruff | 2008-09-02 |
| 7305999 | Centrifugal spray processor and retrofit kit | Trevor Henke, Craig P. Meuchel | 2007-12-11 |
| 5661556 | System for measuring the total integrated scatter of a surface | Tod F. Schiff | 1997-08-26 |
| 5625451 | Methods and apparatus for characterizing a surface | Tod F. Schiff | 1997-04-29 |