Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412810 | Single side via fill process for through-vias | Marvin L. Bernt | 2025-09-09 |
| 7745918 | Package in package (PiP) | — | 2010-06-29 |
JW
Jon Thomas WOODYARD
Amkor Technology: 1 patents #386 of 595Top 65%
Overall (All Time): #1,736,354 of 4,157,543Top 45%
2
Patents All Time