Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12412769 | Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability | Anand KUMAR, Prashant V. Javali | 2025-09-09 | |
| 12183605 | In-situ semiconductor processing chamber temperature apparatus | Andrew Nguyen, Xue Yang Chang, Kartik Ramaswamy | 2024-12-31 | $49,330,000 |