Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950722 | Vertical gate all-around transistor | John H. Zhang, Carl Radens, Lawrence A. Clevenger | 2021-03-16 |
| 10832965 | Fin reveal forming STI regions having convex shape between fins | Haiting Wang, Qun Gao, Scott Beasor, Kyung-Bum Koo, Ankur Arya | 2020-11-10 |
| 10790198 | Fin structures | Fuad H. Al-Amoody, Rishikesh Krishnan | 2020-09-29 |
| 10700214 | Overturned thin film device with self-aligned gate and source/drain (S/D) contacts | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2020-06-30 |
| 10546743 | Advanced interconnect with air gap | John H. Zhang, Yann Mignot, Lawrence A. Clevenger, Carl Radens, Richard S. Wise +2 more | 2020-01-28 |
| 10388639 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-08-20 |
| 10361289 | Gate oxide formation through hybrid methods of thermal and deposition processes and method for producing the same | Wei Zhao, Shahab Siddiqui, Haiting Wang, Ting-Hsiang Hung, Beth Baumert +4 more | 2019-07-23 |
| 10347617 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-07-09 |
| 10319630 | Encapsulated damascene interconnect structure for integrated circuits | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2019-06-11 |
| 10304815 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-05-28 |
| 10211045 | Microwave annealing of flowable oxides with trap layers | Rishikesh Krishnan, Joseph K. Kassim, Bharat Krishnan, Joseph F. Shepard, Jr., Rinus Tek Po Lee | 2019-02-19 |
| 10026849 | Structure and process for overturned thin film device with self-aligned gate and S/D contacts | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2018-07-17 |
| 9984933 | Silicon liner for STI CMP stop in FinFET | Haiting Wang, Wei Zhao, Todd B. Abrams, Jiehui Shu, Jinping Liu +1 more | 2018-05-29 |
| 9905511 | Modular fuses and antifuses for integrated circuits | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2018-02-27 |
| 9837394 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2017-12-05 |
| 9786551 | Trench structure for high performance interconnection lines of different resistivity and method of making same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise | 2017-10-10 |
| 9658523 | Interconnect structure having large self-aligned vias | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Terry A. Spooner +1 more | 2017-05-23 |
| 9659820 | Interconnect structure having large self-aligned vias | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Akil Khamisi Sutton +2 more | 2017-05-23 |
| 9646939 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Byoung Youp Kim, Walter Kleemeier | 2017-05-09 |
| 9633986 | Technique for fabrication of microelectronic capacitors and resistors | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2017-04-25 |
| 9502325 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag | 2016-11-22 |
| 9496415 | Structure and process for overturned thin film device with self-aligned gate and S/D contacts | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2016-11-15 |
| 9412654 | Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step | Junjing Bao, Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag, Richard S. Wise | 2016-08-09 |
| 9391020 | Interconnect structure having large self-aligned vias | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Akil Khamisi Sutton +2 more | 2016-07-12 |
| 9385062 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag | 2016-07-05 |