Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398998 | Methods for high-resolution, stable measurement of pitch and orientation in optical gratings | Jinxin FU, Ludovic Godet | 2025-08-26 |
| 12386155 | Ultra-wide angle lens systems with external pupil | Wubin PANG, Jinxin FU, Samarth Bhargava | 2025-08-12 |
| 12379280 | Method of measuring efficiency for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2025-08-05 |
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Li-Sheng Weng, Zhimin Song | 2025-07-08 |
| 12236575 | In-line metrology systems, apparatus, and methods for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2025-02-25 |
| 12229940 | In-line metrology systems, apparatus, and methods for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2025-02-18 |
| 12203747 | Interference in-sensitive Littrow system for optical device structure measurement | Jinxin FU, Ludovic Godet | 2025-01-21 |
| 12165341 | Optical resolution measurement method for optical devices | Jinxin FU, Ludovic Godet | 2024-12-10 |
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Hung-Yuan Hsu, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |
| 12019242 | Full-field metrology tool for waveguide combiners and meta-surfaces | Jinxin FU, Ludovic Godet | 2024-06-25 |
| 11988574 | Illumination system for AR metrology tool | Jinxin FU, Kazuya Daito, Ludovic Godet | 2024-05-21 |
| 11978196 | See-through metrology systems, apparatus, and methods for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2024-05-07 |
| 11948909 | Package comprising spacers between integrated devices | Dongming He, Lily Zhao | 2024-04-02 |
| 11913776 | Interference in-sensitive Littrow system for optical device structure measurement | Jinxin FU, Ludovic Godet | 2024-02-27 |
| 11808743 | Ion chromatography (IC) suppressor | Chuncheng Ding, Enlai Zhang, Xizhi Zhang | 2023-11-07 |
| 11748875 | See-through metrology systems, apparatus, and methods for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2023-09-05 |
| 11676922 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Li-Sheng Weng, Yue Li | 2023-06-13 |
| 11557557 | Flip-chip flexible under bump metallization size | Dongming He, Lily Zhao | 2023-01-17 |
| 11417622 | Flip-chip device | John Holmes, Xuefeng Zhang, Dongming He | 2022-08-16 |
| 11380613 | Repurposed seed layer for high frequency noise control and electrostatic discharge connection | Yue Li, Li-Sheng Weng | 2022-07-05 |
| 11321837 | Fiber imaging apparatus, methods, and applications | Shuo Pang, Jian Zhao, Axel Schulzgen | 2022-05-03 |
| 10711428 | Supporting device and method for calculating jacking force thereof | Chuntian Li, Biao Liao, Weizheng Kong, Xinyu Shao, Siyuan Zhao +1 more | 2020-07-14 |
| 10325979 | High density and reliable vertical natural capacitors | Junjing Bao, Jun Chen, Stanley Seungchul Song, Giridhar Nallapati | 2019-06-18 |
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Michel Koopmans, Jaspreet S. Gandhi, Josh D. Woodland, Brandon P. Wirz | 2016-06-07 |
| 9123700 | Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias | Jaspreet S. Gandhi, Brandon P. Wirz, Josh D. Woodland | 2015-09-01 |