Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi +2 more | 2025-04-01 |
| 11658378 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Joshua C. Myers, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Sungjun Chun +1 more | 2023-05-23 |
| 11399428 | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication | Pavel Roy Paladhi, Jose A. Hejase, Junyan Tang, Joshua C. Myers, Sungjun Chun +1 more | 2022-07-26 |
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Xiao Hu Liu | 2021-09-28 |
| 10257599 | Slack and strain control mechanism | Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain | 2019-04-09 |
| 10247489 | Structural dynamic heat sink | Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain | 2019-04-02 |
| 10135162 | Method for fabricating a hybrid land grid array connector | Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-20 |
| 10128593 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-13 |
| 9733305 | Frequency-domain high-speed bus signal integrity compliance model | Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win | 2017-08-15 |
| 9686053 | Frequency-domain high-speed bus signal integrity compliance model | Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win | 2017-06-20 |
| 9673941 | Frequency-domain high-speed bus signal integrity compliance model | Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win | 2017-06-06 |
| 9644907 | Structurally dynamic heat sink | Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain | 2017-05-09 |
| 9638750 | Frequency-domain high-speed bus signal integrity compliance model | Daniel M. Dreps, Jose A. Hejase, Glen A. Wiedemeier, Si T. Win | 2017-05-02 |
| 9625220 | Structurally dynamic heat sink | Bjorn J. Ahbel, Marc H. Coq, Milnes P. David, Ryan Elsasser, Syed F. Hossain | 2017-04-18 |
| 9627787 | DIMM connector region vias and routing | William L. Brodsky, Matteo Cocchini, Michael A. Cracraft | 2017-04-18 |
| 9548551 | DIMM connector region vias and routing | William L. Brodsky, Matteo Cocchini, Michael A. Cracraft | 2017-01-17 |
| 9444162 | DIMM connector region vias and routing | William L. Brodsky, Matteo Cocchini, Michael A. Cracraft | 2016-09-13 |
| 9052880 | Multi-level interconnect apparatus | Alan F. Becker, William L. Brodsky, John G. Torok | 2015-06-09 |
| 8683413 | Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost | Jinwoo Choi, Tingdong Zhou | 2014-03-25 |
| 8339803 | High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost | Jinwoo Choi, Tingdong Zhou | 2012-12-25 |
| 8295419 | Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system | Charlie C. Hwang, Timothy G. McNamara, Ching-Lung Tong | 2012-10-23 |
| 8261226 | Network flow based module bottom surface metal pin assignment | Ruchir Puri, Haoxing Ren, Hua Xiang, Tingdong Zhou | 2012-09-04 |
| 8050174 | Self-healing chip-to-chip interface | Daniel M. Dreps, Frank D. Ferraiolo, Anand Haridass, Robert J. Reese | 2011-11-01 |
| 8018837 | Self-healing chip-to-chip interface | Daniel M. Dreps, Frank D. Ferraiolo, Anand Haridass, Robert J. Reese | 2011-09-13 |
| 7987587 | Method of forming solid vias in a printed circuit board | Michael F. McAllister, Alan Daniel Stigliani, John G. Torok | 2011-08-02 |