Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8876122 | Level control for vehicles having at least one air spring | — | 2014-11-04 |
| 7570492 | Apparatus for venting an electronic control module | Michael Pfeifer, Anthony J. Polak, Michael J. Pomeroy | 2009-08-04 |
| 7353983 | Vertical removal of excess solder from a circuit substrate | William Weigler, Robert Babula, James E. Herbold, Steven G. Sharkey | 2008-04-08 |
| 7300820 | Adhesive assembly for a circuit board | Jinbao Jiao, Kevin D. Moore, William Weigler | 2007-11-27 |
| 7075794 | Electronic control unit | Kevin D. Moore, Timothy J. Trento | 2006-07-11 |
| 6927344 | Flexible circuit board assembly | Richard A. Hawkins, Kevin D. Moore | 2005-08-09 |
| 6749105 | Method and apparatus for securing a metallic substrate to a metallic housing | Ying Wang | 2004-06-15 |
| 6594891 | Process for forming multi-layer electronic structures | James Steven Kamperman, David B. Stone | 2003-07-22 |
| 6501661 | Electronic control unit | Kevin D. Moore, Jeffrey D. Lord | 2002-12-31 |
| 6483037 | Multilayer flexible FR4 circuit | Kevin D. Moore | 2002-11-19 |
| 6098280 | Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes | James Steven Kamperman, David B. Stone | 2000-08-08 |
| 5773195 | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap | James Steven Kamperman, David B. Stone | 1998-06-30 |
| 5734560 | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap | James Steven Kamperman, David B. Stone | 1998-03-31 |
| 5709805 | Method for producing multi-layer circuit board and resulting article of manufacture | Charles R. Davis | 1998-01-20 |
| 5679444 | Method for producing multi-layer circuit board and resulting article of manufacture | Charles R. Davis | 1997-10-21 |
| 5659951 | Method for making printed circuit board with flush surface lands | David B. Stone, Russell Thomas White, Jr., James R. Wilcox | 1997-08-26 |
| 5442144 | Multilayered circuit board | William T. Chen, James R. Wilcox, Tien Y. Wu | 1995-08-15 |
| 5403420 | Fabrication tool and method for parallel processor structure and package | James R. Loomis, David B. Stone, Cheryl L. Tytran, James R. Wilcox | 1995-04-04 |
| 5391514 | Low temperature ternary C4 flip chip bonding method | Anthony P. Ingraham | 1995-02-21 |
| 5379193 | Parallel processor structure and package | James R. Loomis | 1995-01-03 |
| 5374344 | Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate | James Wilcox | 1994-12-20 |
| 5363553 | Method of drilling vias and through holes | Robert D. Edwards, Frank D. Egitto, Paul S. Gursky, David E. Houser, James Steven Kamperman +1 more | 1994-11-15 |
| 5359767 | Method of making multilayered circuit board | William T. Chen, James R. Wilcox, Tien Y. Wu | 1994-11-01 |
| 5347710 | Parallel processor and method of fabrication | Howard L. Heck, John S. Kresge | 1994-09-20 |
| 5185073 | Method of fabricating nendritic materials | Perminder S. Bindra, Jerome J. Cuomo, Anthony P. Ingraham, Sung Kwon Kang, Jungihl Kim +10 more | 1993-02-09 |