RH

Ryo Haruta

HI Hitachi: 16 patents #2,438 of 28,497Top 9%
HS Hitachi Hokkai Semiconductor: 8 patents #3 of 98Top 4%
RT Renesas Technology: 5 patents #592 of 3,337Top 20%
HS Hitachi Microcomputer System: 3 patents #41 of 257Top 20%
Overall (All Time): #186,481 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6897570 Semiconductor device and method of manufacturing same Takashi Nakajima, Naotaka Tanaka, Yasuyuki Nakajima, Tomoo Matsuzawa, Masashi Sahara +1 more 2005-05-24
6887739 Method of manufacturing semiconductor package including forming a resin sealing member Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2005-05-03
6844219 Semiconductor device and lead frame therefor Makoto Kitano, Akihiro Yaguchi, Naotaka Tanaka, Takeshi Terasaki, Ichiro Anjoh +2 more 2005-01-18
6764878 Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2004-07-20
6759279 Method of manufacturing semiconductor device having resin sealing body Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2004-07-06
6621160 Semiconductor device and mounting board Masanori Shibamoto, Masahiro Ichitani, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo 2003-09-16
6590275 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2003-07-08
6563212 Semiconductor device Masanori Shibamoto, Masahiro Ichitani, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo 2003-05-13
6512176 Semiconductor device Akihiro Yaguchi, Masahiro Ichitani 2003-01-28
6476467 Semiconductor device and process for producing the same Hisao Nakamura, Seiichi Ichihara, Ryosuke Kimoto, Hiroshi Kawakubo, Hiroshi Koyama 2002-11-05
6476466 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2002-11-05
6465876 Semiconductor device and lead frame therefor Makoto Kitano, Akihiro Yaguchi, Naotaka Tanaka, Takeshi Terasaki, Ichiro Anjoh +2 more 2002-10-15
6448111 Method of manufacturing a semiconductor device Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2002-09-10
6437428 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2002-08-20
6404049 Semiconductor device, manufacturing method thereof and mounting board Masanori Shibamoto, Masahiro Ichitani, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo 2002-06-11
6340793 Semiconductor device Akihiro Yaguchi, Masahiro Ichitani 2002-01-22
6278176 Semiconductor device and process for producing the same Hisao Nakamura, Seiichi Ichihara, Ryosuke Kimoto, Hiroshi Kawakubo, Hiroshi Koyama 2001-08-21
6232650 Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani 2001-05-15
6120301 Semiconductor device and method of manufacturing the same Masahiro Ichitani, Katsuyuki Matsumoto, Arata Kinjyo, Tsutomu Kakimoto 2000-09-19
6060770 Semiconductor device and process for producing the same Hisao Nakamura, Seiichi Ichihara, Ryosuke Kimoto, Hiroshi Kawakubo, Hiroshi Koyama 2000-05-09
5336638 Process for manufacturing semiconductor devices Masayuki Suzuki, Hiroshi Shinriki, Masayuki Nakata 1994-08-09
5140272 Method of semiconductor surface measurment and an apparatus for realizing the same Shigeru Nishimatsu, Tatsumi Mizutani, Kanji Tsujii, Chusuke Munakata, Shigeyuki Hosoki 1992-08-18
4570175 Three-dimensional semiconductor device with thin film monocrystalline member contacting substrate at a plurality of locations Masanobu Miyao, Makoto Ohkura, Iwao Takemoto, Terunori Warabisako, Kiichiro Mukai +3 more 1986-02-11