Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322619 | Dynamic process control in semiconductor manufacturing | Purushottam Kumar, Tengfei Miao, Gengwei Jiang, Daniel Ho, Joseph R. Abel +1 more | 2025-06-03 |
| 12308264 | Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports | Ravi Kumar, Adrien LaVoie, Ramesh Chandrasekharan, Michael Philip Roberts | 2025-05-20 |
| 12209312 | Temperature control of a multi-zone pedestal | Ramesh Chandrasekharan, Michael Philip Roberts, Aaron Bingham, Ashish Saurabh, Adrien LaVoie +1 more | 2025-01-28 |
| 12186851 | Use of vacuum during transfer of substrates | Ramesh Chandrasekharan, Michael Philip Roberts, Paul Konkola, Michael G. R. Smith, Brian Joseph Williams +2 more | 2025-01-07 |
| 12071689 | Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes | Ramesh Chandrasekharan, Michael Philip Roberts, Adrien LaVoie, Ravi Kumar, Nuoya Yang +2 more | 2024-08-27 |
| 12057300 | Apparatus for cleaning plasma chambers | Adrien LaVoie, Frank L. Pasquale, Purushottam Kumar | 2024-08-06 |
| 12040181 | Modulated atomic layer deposition | Chan Myae Myae Soe, Chloe Baldasseroni, Shiva Sharan Bhandari, Adrien LaVoie, Bart J. van Schravendijk | 2024-07-16 |
| 11913113 | Method and apparatus for modulating film uniformity | Adrien LaVoie, Purushottam Kumar | 2024-02-27 |
| 11651963 | Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film | Ishtak Karim, Joseph R. Abel, Purushottam Kumar, Adrien LaVoie | 2023-05-16 |
| 11542599 | Method and apparatus for providing station to station uniformity | Adrien LaVoie | 2023-01-03 |
| 11520828 | Methods for representing and storing data in a graph data structure using artificial intelligence | Santanu Chakrabarty, Ajitha C, Siddhant Lahoti | 2022-12-06 |
| 11322416 | Controller for controlling core critical dimension variation using flash trim sequence | Adrien LaVoie, Ravi Kumar, Purushottam Kumar | 2022-05-03 |
| 11236422 | Multi zone substrate support for ALD film property correction and tunability | Michael Philip Roberts, Ramesh Chandrasekharan, Aaron Bingham, Ashish Saurabh, Ravi Kumar +1 more | 2022-02-01 |
| 11078570 | Azimuthal critical dimension non-uniformity for double patterning process | Adrien LaVoie, Frank L. Pasquale, Ravi Kumar | 2021-08-03 |
| 10978302 | Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film | Ishtak Karim, Joseph R. Abel, Purushottam Kumar, Adrien LaVoie | 2021-04-13 |
| 10847352 | Compensating chamber and process effects to improve critical dimension variation for trim process | Adrien LaVoie, Ravi Kumar, Purushottam Kumar | 2020-11-24 |
| 10801109 | Method and apparatus for providing station to station uniformity | Adrien LaVoie | 2020-10-13 |
| 10727143 | Method for controlling core critical dimension variation using flash trim sequence | Adrien LaVoie, Ravi Kumar, Purushottam Kumar | 2020-07-28 |
| 10658172 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Joseph R. Abel, Richard Phillips, Purushottam Kumar, Adrien LaVoie | 2020-05-19 |
| 10655224 | Conical wafer centering and holding device for semiconductor processing | Ishtak Karim, Purushottam Kumar, Adrien LaVoie, Sung Je Kim, Patrick Breiling | 2020-05-19 |
| 10579371 | Recommendations for custom software upgrade by cognitive technologies | Santanu Chakrabarty, Sivaranjani Kathirvel, Sivaraj Sethunamasivayam | 2020-03-03 |
| 10494715 | Atomic layer clean for removal of photoresist patterning scum | Purushottam Kumar, Adrien LaVoie | 2019-12-03 |
| 10431451 | Methods and apparatuses for increasing reactor processing batch size | Purushottam Kumar, Richard Phillips, Adrien LaVoie | 2019-10-01 |
| 10431489 | Substrate support apparatus having reduced substrate particle generation | Song-Moon Suh, Glen T. Mori, Steven V. Sansoni | 2019-10-01 |
| 10269559 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Joseph R. Abel, Richard Phillips, Purushottam Kumar, Adrien LaVoie | 2019-04-23 |