Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357988 | Die seal ring | Cheng-Chou Hung, Victor Chiang Liang, Cheng-Hung Li, Sheng-Yi Huang, Tzung-Lin Li +2 more | 2013-01-22 |
| 8022509 | Crack stopping structure and method for fabricating the same | — | 2011-09-20 |
| 7696606 | Metal structure | Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang | 2010-04-13 |
| 7649268 | Semiconductor wafer | Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang | 2010-01-19 |
| 7518211 | Chip and package structure | — | 2009-04-14 |
| 7387950 | Method for forming a metal structure | Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang | 2008-06-17 |
| 7268440 | Fabrication of semiconductor integrated circuit chips | Zong-Huei Lin, Hung-Min Liu, Wen-Tung Chang, Kuo-Ming Chen, Kai-Kuang Ho | 2007-09-11 |
| 7256475 | On-chip test circuit for assessing chip integrity | Chien-Li Kuo | 2007-08-14 |
| 7250670 | Semiconductor structure and fabricating method thereof | Chien-Li Kuo, Bing Wu | 2007-07-31 |
| 7176555 | Flip chip package with reduced thermal stress | Chien-Li Kuo | 2007-02-13 |
| 7026234 | Parasitic capacitance-preventing dummy solder bump structure and method of making the same | Shing-Ren Sheu, Kuo-Ming Chen, Hung-Min Liu, Kun-Chih Wang | 2006-04-11 |
| 6415974 | Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity | — | 2002-07-09 |
| 6391758 | Method of forming solder areas over a lead frame | Randy H. Y. Lo | 2002-05-21 |
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chih-Shun Chen, Chao-Dung Suo, Ke Yang, Feng-Lung Chien | 2002-02-19 |
| 6306682 | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Chien-Ping Huang, Randy H. Y. Lo, Tzong-Da Ho, Eric Ko | 2001-10-23 |
| 6265763 | Multi-chip integrated circuit package structure for central pad chip | Eric Ko, Vicky Liu | 2001-07-24 |
| 6249433 | Heat-dissipating device for integrated circuit package | Chien-Ping Huang | 2001-06-19 |