Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7070909 | UV absorbing glass cloth and use thereof | Robert M. Japp, Pamela Lulkoski, Jan Obrzut, Kenneth Lynn Potter | 2006-07-04 |
| 7007378 | Process for manufacturing a printed wiring board | John G. Gaudiello, James D. Herard, John J. Konrad, Timothy L. Wells | 2006-03-07 |
| 6931722 | Method of fabricating printed circuit board with mixed metallurgy pads | Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more | 2005-08-23 |
| 6919514 | Structure having laser ablated features and method of fabricating | John J. Konrad, James Warren Wilson | 2005-07-19 |
| 6838400 | UV absorbing glass cloth and use thereof | Robert M. Japp, Pamela Lulkoski, Jan Obrzut, Kenneth Lynn Potter | 2005-01-04 |
| 6730857 | Structure having laser ablated features and method of fabricating | John J. Konrad, James Warren Wilson | 2004-05-04 |
| 6586683 | Printed circuit board with mixed metallurgy pads and method of fabrication | Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more | 2003-07-01 |
| 6485892 | Method for masking a hole in a substrate during plating | Lawrence Robert Blumberg, Norman A. Card, Richard A. Day, Stephen Joseph Fuerniss, John J. Konrad +1 more | 2002-11-26 |
| 6025057 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Heike Marcello | 2000-02-15 |
| 5866237 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Heike Marcello | 1999-02-02 |
| 5599747 | Method of making circuitized substrate | Ashwinkumar C. Bhatt, Thomas P. Duffy, David E. Houser, Gerald W. Jones, Kenneth Lynn Potter | 1997-02-04 |
| 5578796 | Apparatus for laminating and circuitizing substrates having openings therein | Ashwinkumar C. Bhatt, Thomas P. Duffy, Gerry A. Hackett | 1996-11-26 |
| 5542175 | Method of laminating and circuitizing substrates having openings therein | Ashwinkumar C. Bhatt, Thomas P. Duffy, Gerry A. Hackett | 1996-08-06 |
| 5229550 | Encapsulated circuitized power core alignment and lamination | Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Robert E. Ruane, Edwin L. Thomas | 1993-07-20 |
| 5129142 | Encapsulated circuitized power core alignment and lamination | Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Robert E. Ruane, Edwin L. Thomas | 1992-07-14 |